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Material cleaning method, device and controller

A technology for controllers and cleaning stations, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as unclean edge cleaning

Active Publication Date: 2020-12-15
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the object of the present invention is to provide a material cleaning method, device and controller, to alleviate the technical problem that the edge cleaning is not clean because the position where N2 and IPA are extracted in the IPA process is the center of the wafer.

Method used

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  • Material cleaning method, device and controller
  • Material cleaning method, device and controller
  • Material cleaning method, device and controller

Examples

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Embodiment 1

[0034] The embodiment of the present invention provides a material cleaning method, which is applied to the controller of the cleaning table. The cleaning table includes a workbench and an IPA motor. The material to be cleaned is fixed on the workbench, and an IPA nozzle is arranged vertically below the IPA motor. , The IPA nozzle is also equipped with an on-off valve, and the controller is connected to the workbench, IPA motor and on-off valve in communication; figure 1 A flow chart of a material cleaning method shown, the method may further comprise the steps:

[0035] Step S102, if it is detected that the material to be cleaned is fixed to the workbench, obtain the operating parameters of the workbench, and control the workbench to drive the material to be cleaned to rotate horizontally according to the operating parameters;

[0036] Specifically, the material to be cleaned in this embodiment is a wafer, and the controller is the controller of the control center platform of...

Embodiment 2

[0053] On the basis of the above embodiments, the embodiment of the present invention also provides a material cleaning device, which is applied to the controller of the cleaning table. The cleaning table includes a workbench and an IPA motor. There is an IPA nozzle under the IPA motor, and the IPA nozzle is also equipped with an on-off valve, and the control center communicates with the workbench, the IPA motor, and the on-off valve; Figure 4 A structural schematic diagram of a material cleaning device shown, the device includes:

[0054] The first acquisition module 402 is used to obtain the operating parameters of the workbench if it is detected that the material to be cleaned is fixed to the workbench, and control the workbench to drive the material to be cleaned to rotate horizontally according to the operation parameters;

[0055] The second obtaining module 404 is used to obtain the IPA motor parameters, wherein the IPA motor parameters include: the IPA motor's motion ...

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Abstract

The invention provides a material cleaning method and device, and a controller, and relates to the technical field of material cleaning. The method comprises the steps of acquiring operating parameters of the workbench when the material to be cleaned is fixed to a workbench; controlling the workbench according to the operating parameters to drive the material to be cleaned to horizontally rotate;obtain parameters of an IPA motor, wherein the parameters of the IPA motor include a movement starting point, a movement end point, a running frequency, a number of movement zones and a running time of each movement zone of the IPA motor; controlling the IPA motor according to the parameters of the IPA motor to run in each movement zone; obtaining working state information of the IPA motor duringrunning, wherein the working state information includes the movement direction of the IPA motor and the movement zone where the current IPA motor is located; and controlling the switching state of anon-off valve according to the working state information. The material cleaning method effectively alleviates the technical problem that the locations of N2 and IPA extracted in the IPA process are atthe center of the wafer, which is easy to cause poor edge cleaning.

Description

technical field [0001] The invention relates to the technical field of material cleaning, in particular to a material cleaning method, device and controller. Background technique [0002] The IPA (Isopropyl Alcohol, isopropyl alcohol) process refers to a cleaning process that utilizes IPA steam for dehydration and drying. The conventional method of cleaning wafers with IPA is to use the characteristics of low surface tension and volatility of IPA to replace the water with high surface tension on the surface, and then blow dry with N2 to realize the drying and drying of wafers. [0003] At present, the IPA process adopts the method of centrifugal drying, which has a good effect in reducing the introduction of contaminants and drying speed. Since the position where nitrogen N2 and IPA are extracted in the IPA process is the center of the wafer, it is easy to cause edge The problem of unclean cleaning. Contents of the invention [0004] In view of this, the object of the pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/67
Inventor 李嘉浪周庆亚田洪涛杨旭张金环蒋锡兵王栋
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD