Check patentability & draft patents in minutes with Patsnap Eureka AI!

Electronic device with integrated shell

A technology for electronic devices and casings, applied in the direction of electrical components, magnetic field/electric field shielding, casings/cabinets/drawer components, etc.

Inactive Publication Date: 2019-06-21
MICROELECTRONICS TECH INC
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among the various techniques that have been proposed, enclosures are used to shield the electronic components on the printed circuit board, thus limiting the outward emission of EMI generated by the electronic products, thus protecting these products from external sources of EMI affecting their operation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device with integrated shell
  • Electronic device with integrated shell
  • Electronic device with integrated shell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] The following description of the disclosure, accompanied by the accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure to which, however, the disclosure is not limited. In addition, the following embodiments can be properly integrated to complete another embodiment.

[0046] "An embodiment," "an embodiment," "an exemplary embodiment," "another embodiment," "another embodiment" and the like mean that the embodiments described in the present disclosure may include a particular feature, structure, or characteristic, however Not every embodiment must include the particular feature, structure or characteristic. Also, repeated use of the phrase "in an embodiment" does not necessarily refer to the same embodiment, but could be.

[0047] In order to make the present disclosure fully understandable, the following description provides detailed steps and structures. Obviously, the practice of the pres...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electronic device includes a housing and a connector. Wherein the shell comprises an outer surface, an inner surface, a hole and a plurality of shielding walls, the hole extends from the outer surface to the inner surface, and the plurality of shielding walls are arranged on the inner surface and are adjacent to the hole. The connector comprises a cover body, and the cover body is provided witha plurality of shielding walls which are provided with spring supporting arms and abut against the shell.

Description

technical field [0001] This application claims priority and the benefit of U.S. Formal Application No. 15 / 838,712, filed December 12, 2017, the contents of which are incorporated herein by reference in their entirety. [0002] Embodiments of the present disclosure relate to an electronic device with an integrated housing, and more particularly to an electronic device with an integrated housing that can realize electromagnetic interference shielding and electrical grounding. Background technique [0003] In many electronic devices, including computer devices, a large number of electronic components are usually arranged on one or more circuit boards. Generally, these circuit boards are arranged in parallel in the enclosure. With the increased use of electronic products in office environments, electromagnetic interference ("EMI") has become an important consideration in the design of such products. In various techniques that have been proposed, enclosures are used to shield t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K5/02H05K9/00
Inventor 刘正鸿黄毓辉
Owner MICROELECTRONICS TECH INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More