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Component failure source-based MMC reliability analysis method

An analysis method and reliability technology, applied in environmental/reliability testing, instruments, electrical components, etc., can solve problems such as inaccurate failure rate experience data, optimize system structure, improve reliability and service life, and solve problems The effect of necessary costs

Inactive Publication Date: 2019-10-25
XI AN JIAOTONG UNIV +3
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Problems solved by technology

Since different MMCs are subjected to different stresses during normal operation, it is not accurate enough to use only empirical data on component failure rates in system-level reliability assessment.

Method used

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  • Component failure source-based MMC reliability analysis method
  • Component failure source-based MMC reliability analysis method
  • Component failure source-based MMC reliability analysis method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0070] Taking the 232 module MMC of Zhangbei Project as an example, the relevant parameters of the system are shown in Table 1, and the half-bridge sub-module MMC used is as follows: figure 1 shown.

[0071] Table 1 Main parameters of MMC system

[0072]

[0073]

[0074] The first step is to build a simulation platform in MATLAB according to the main system parameters in Table 1 to obtain the IGBT and capacitor voltage.

[0075] In the second step, according to the simulation image 3 and Figure 4 The calculated failure rates of IGBTs and capacitors are shown in Table 2 under ideal conditions at room temperature of 25°C.

[0076] Table 2 Key components and system failure rate

[0077] components Failure rate / FIT IGBT 44.58 Submodule Capacitance 4.56 Thyristor 47 bypass switch 1000 Control System 263

[0078] In the third step, the sub-module used is a half-bridge structure such as figure 1 As shown, in order to mainta...

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Abstract

The invention discloses a component failure source-based MMC reliability analysis method. Taking a half-bridge submodule MMC as an example, reliability analysis is carried out from components to a system through electric stress obtained from simulation. The effects of temperature and voltage on the system-level reliability of the MMC under normal operating conditions and extreme conditions are obtained through a reliability block diagram and hot standby redundancy modes according to a component-level reliability failure factor to improve an existing reliability analysis method. The method fromcomponent-level failure rate evaluation to system-level reliability analysis and the analysis process for a failure source can be applied to reliability analysis of the other systems and can be usedas references of balancing the economy and the reliability in practical engineering, and the system reliability design is optimized from the component failure rate.

Description

technical field [0001] The invention belongs to the technical field of flexible direct current transmission, and in particular relates to an MMC reliability analysis method based on device failure sources. Background technique [0002] In the field of flexible DC transmission technology, Modular Multilevel Converter (MMC) is widely used due to its low switching frequency, low loss, low filter requirements and high reliability of modular design. Since the modular multilevel converter (MMC) is a power electronic converter that needs redundancy to supplement faulty sub-modules, its reliability attenuation problem is an urgent problem to be solved at present, so the reliability analysis of MMC can be done from the design Improve its economy and safety at the same level. [0003] Usually, the reliability analysis of MMC is divided into component level and system level. [0004] The reliability attenuation at the component level mainly comes from key components in the MMC sub-mo...

Claims

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Application Information

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IPC IPC(8): G01R31/00H02J3/36H02M7/00
CPCG01R31/003H02J3/36H02M7/00H02J2203/20Y02E60/60
Inventor 王跃吕高泰尹太元雷万钧宣佳卓王朝亮
Owner XI AN JIAOTONG UNIV
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