Laser tape cutting machine for PCB tape cutting
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUIZHOU CHENGTAI AUTOMATION TECH CO LTD
- Publication Date
- 2020-03-27
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Abstract
Description
technical field
[0001] The invention relates to the field of PCBs, in particular to a laser cutting machine for glue cutting of PCBs. Background technique
[0002] In the PCB industry, before the PCB drilling process, the PCB stack needs to be pinned and the edge is covered with glue. After the drilling is completed, the PCB stack needs to be disassembled, pinned, glued, and separated. At present, the rubber tapping equipment on the market after PCB dismantling is still unstable, and the rubber tapping adopts the blade cutting method. Due to the short service life of the blade, it needs to be replaced every 1 hour, and four of them need to be replaced each time, which takes about 15 minutes; extremely The production efficiency is greatly reduced; in addition, the blade holder adopts an elastic mechanism, which is prone to continuous cutting of rubber and cutting, causing PCB to be lifted and injured during the subsequent process of manipulator separation, and the equipment a...