Laser tape cutting machine for PCB tape cutting

A glue cutting machine and laser technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of reducing production efficiency, affecting normal operations, falling, etc., to increase cutting efficiency, increase cutting quality and cut efficiency effect
CN110919201APending Publication Date: 2020-03-27HUIZHOU CHENGTAI AUTOMATION TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUIZHOU CHENGTAI AUTOMATION TECH CO LTD
Publication Date
2020-03-27

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Abstract

The invention relates to a laser tape cutting machine for PCB tape cutting and belongs to the field of PCBs. The laser tape cutting machine comprises a rack. A first guide rail is arranged on the rack, and a moving mechanism is movably arranged on the first guide rail. The moving mechanism comprises a bottom plate movably arranged on the first guide rail. The bottom plate is in driving connectionwith a first driving mechanism arranged on the rack, and the first driving mechanism is used for driving the bottom plate to move along the first guide rail in a reciprocating manner. Supports are correspondingly arranged at the front end and the rear end of the bottom plate. A support plate used for containing the PCBs is arranged on each support. A rotating lifting mechanism is arranged on the rack. Laser cutters are arranged on the rack, and the laser cutters are located on the left side and the right side of the first guide rail. According to the laser tape cutting machine for PCB tape cutting, the laser is adopted to cut the adhesive tape on the PCBs, and compared with a mode of using a cutting blade for cutting the adhesive tape, by the adoption of the laser tape cutting machine, a blade does not need to be replaced, the cutting efficiency is improved, the situation that the adhesive tape cannot be cut off is avoided, and the cutting quality and the cutting efficiency can be improved effectively.
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Description

technical field

[0001] The invention relates to the field of PCBs, in particular to a laser cutting machine for glue cutting of PCBs. Background technique

[0002] In the PCB industry, before the PCB drilling process, the PCB stack needs to be pinned and the edge is covered with glue. After the drilling is completed, the PCB stack needs to be disassembled, pinned, glued, and separated. At present, the rubber tapping equipment on the market after PCB dismantling is still unstable, and the rubber tapping adopts the blade cutting method. Due to the short service life of the blade, it needs to be replaced every 1 hour, and four of them need to be replaced each time, which takes about 15 minutes; extremely The production efficiency is greatly reduced; in addition, the blade holder adopts an elastic mechanism, which is prone to continuous cutting of rubber and cutting, causing PCB to be lifted and injured during the subsequent process of manipulator separation, and the equipment a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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