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Pressure field surveying device and method of cleaning glass substrate using same

A glass substrate, pressure field technology, applied in the direction of using tools for cleaning, cleaning methods and utensils, hydraulic/pneumatic metering, etc., can solve problems such as difficulty in reducing particle defects and lack of equipment.

Active Publication Date: 2021-11-09
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Regarding glass substrate manufacturing processes, there are few facilities for objective and quantitative testing or evaluation of cleaning processes, making it difficult to reduce the occurrence of particle defects

Method used

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  • Pressure field surveying device and method of cleaning glass substrate using same
  • Pressure field surveying device and method of cleaning glass substrate using same
  • Pressure field surveying device and method of cleaning glass substrate using same

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Embodiment Construction

[0042] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like components throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects of the present description. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, when the expression "at least one" precedes a series of components, it modifies the entire series of components rather than the individual components of the series.

[0043] The inventive concept will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. However, the inventive concept may be embodied in ...

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Abstract

A pressure field mapping device and a method of cleaning a glass substrate using the device are provided. The pressure field mapping apparatus includes a support substrate; a plurality of pressure sensors arranged on the support substrate, each pressure sensor configured to output a signal in response to pressure applied to the pressure sensor; a waterproof bag surrounding the support substrate; and an analyzer , configured to receive a signal from each of the plurality of pressure sensors and output a pressure map on the support substrate in real time based on the received signals. By using the pressure field mapping apparatus and the method of cleaning a glass substrate using the apparatus, objective and quantitative testing can be performed without variation among workers in the cleaning process, thus greatly reducing product defects such as particle defects.

Description

technical field [0001] This application claims the priority of Korean Application No. 10-2017-0092736 filed on July 21, 2017 in accordance with the Patent Law, relies on the content of said patent, and its entire content is incorporated herein by reference. [0002] One or more embodiments relate to pressure field mapping apparatus and methods of cleaning glass substrates using the same, and more particularly to pressures that can be objectively and quantitatively tested without inter-worker variability in the cleaning process Field mapping apparatus and method of cleaning a glass substrate using the apparatus. Background technique [0003] As consumer demands for high surface quality glass substrates have increased and glass substrates having larger areas have become more commonly used, the likelihood of particle defects occurring during the process of manufacturing glass substrates has increased. [0004] Regarding glass substrate manufacturing processes, there are few fa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14G01L15/00B08B11/04
CPCB08B1/00B08B1/02B08B11/04G01L1/02G01L1/146G01L15/00
Inventor 金相模朴俊昱朴星河宋英俊
Owner CORNING INC