Synchronous Superplastic Deformation Diffusion Joining Method for Aluminum Alloy Multilayer Boards

Abstract

A method for synchronous superplastic deformation diffusion connection of aluminum alloy multi-layer boards, by constructing a vacuum environment between multi-layer bodies to be connected and then placing them in a superplastic forming diffusion connection mold, applying a load to the mold through a press, and heating the bodies to be connected At the same time, through the mold, argon gas is introduced from the top of the body to be connected until the required pressure holding time of diffusion connection is reached, and the different plastic characteristics of the matrix and the oxide film of the body to be connected are used to make the oxide film break during the simultaneous deformation connection process, and the to-be-connected The connection interface is completely welded, and the diffusion connection formed part is obtained after the connection body is completely deformed and molded and cooled. The invention solves the problem of poor interface quality of aluminum alloy diffusion connection; it can manufacture multi-layer structural parts, and the number and shape of formed layers can be adjusted according to actual needs. The method adopted in the invention is simple and efficient, does not require special equipment and materials, reduces costs, and is easy to realize industrialized production.

Description

technical field [0001] The invention relates to a technology in the field of superplastic forming and diffusion connection, in particular to a method for synchronous superplastic deformation diffusion connection of aluminum alloy multilayer boards. Background technique [0002] In the process of diffusion bonding of aluminum alloys, since the surface is easily oxidized, a dense and continuous oxide film is formed, which seriously hinders the aluminum atoms from passing through the diffusion bonding surface, and the oxide layer is very stable, and has a very limited resistance at high temperature. Dissolved in the matrix, it is easy to form a defective interface. Therefore, it is technically feasible to use superplastic deformation to break the oxide film and achieve a good metallurgical bond at the aluminum alloy interface. The existing technology has the following problems: a set of superplastic forming enhanced diffusion bonding performance device is designed by modifying...

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Problems solved by technology

The existing technology has the following problems: a set of superplastic forming enhanced diffusion bonding performance device is designed by modifying the stretching machine, and the superplastic stretching and diffusion bonding experiments are simultaneously carried out on the 7475 aluminum alloy, which obviously reduces the thickness of the original sheet, and the forming The size of the sample is small and cannot be applied to the manufacture of actual components; the low-temperature diffusion bonding method of the aluminum alloy interface for enhanced heat transfer at the interface requires special treatment of the aluminum alloy surface and the addition of an intermediate layer, which leads to the introduction of Multiple components; aluminum alloy diffusion bonding method with added magnetic pulse power makes the aluminum alloy easily deformed due to the application of electromagnetic pulse force

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