Aluminum alloy sandwich plate synchronous superplastic deformation diffusion bonding method

Abstract

The invention provides an aluminum alloy sandwich plate synchronous superplastic deformation diffusion bonding method. The aluminum alloy sandwich plate synchronous superplastic deformation diffusionbonding method comprises the steps that a vacuum environment is built between multilayer bodies to be connected and the multilayer bodies to be connected are placed in a superplastic forming diffusionbonding die, a press applies a load on the die, the bodies to be connected are heated, meanwhile, argon is pumped from the upper parts of the bodies to be connected through the die to reach requireddiffusion bonding pressure-holding time, the characteristics of the difference between the plasticity of base bodies of the bodies to be connected and the plasticity of an oxidation film are used forenabling the oxidation film to be crushed in the process of synchronous deformation connection, an interface to be connected is completely welded, and a diffusion bonding forming piece is obtained after the bodies to be connected is completely deformed and a pasted die is cooled. The problem of poor quality of the aluminum alloy diffusion bonding interface is solved, multilayer structural pieces can be manufactured, and the number of formed layers and shapes can be adjusted according to the requirements. The method is simple and efficient, special equipment and materials are not required, thecost is reduced, and the industrial production is easy to realize.

Description

technical field [0001] The invention relates to a technology in the field of superplastic forming and diffusion connection, in particular to a method for synchronous superplastic deformation diffusion connection of aluminum alloy multilayer boards. Background technique [0002] In the process of diffusion bonding of aluminum alloys, since the surface is easily oxidized, a dense and continuous oxide film is formed, which seriously hinders the aluminum atoms from passing through the diffusion bonding surface, and the oxide layer is very stable, and has a very limited resistance at high temperature. Dissolved in the matrix, it is easy to form a defective interface. Therefore, it is technically feasible to use superplastic deformation to break the oxide film and achieve a good metallurgical bond at the aluminum alloy interface. The existing technology has the following problems: a set of superplastic forming enhanced diffusion bonding performance device is designed by modifying...

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Problems solved by technology

The existing technology has the following problems: a set of superplastic forming enhanced diffusion bonding performance device is designed by modifying the stretching machine, and the superplastic stretching and diffusion bonding experiments are simultaneously carried out on the 7475 aluminum alloy, which obviously reduces the thickness of the original sheet, and the forming The size of the sample is small and cannot be applied to the manufacture of actual components; the low-temperature diffusion bonding method of the aluminum alloy interface for enhanced heat transfer at the interface requires special treatment of the aluminum alloy surface and the addition of an intermediate layer, which leads to the introduction of Multiple components; aluminum alloy diffusion bonding method with added magnetic pulse power makes the aluminum alloy easily deformed due to the application of electromagnetic pulse force

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