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A laser in-situ assisted turning tool and its application method

An auxiliary lathe and laser technology, which is applied in the direction of cutting tools for lathes, turning equipment, laser welding equipment, etc., can solve the problems of insufficient tool rigidity, inconvenience, and inability to realize in-situ auxiliary heating, etc.

Active Publication Date: 2022-06-03
CHANGCHUN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the optical-mechanical structure integration inside the tool handle, the adjustment of the laser incident angle is inflexible and inconvenient when the laser is incident in situ; and the hollow tool handle will lead to insufficient rigidity of the tool, which is prone to instability
[0005] Summary: The existing technology has the following problems for laser-assisted processing. First, in-situ auxiliary heating cannot be realized, and the utilization rate of laser energy is low; second, the adjustment of laser incident angle is not flexible.

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  • A laser in-situ assisted turning tool and its application method
  • A laser in-situ assisted turning tool and its application method
  • A laser in-situ assisted turning tool and its application method

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Embodiment Construction

[0024] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. Where the following description refers to the drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the illustrative examples below are not intended to represent all implementations consistent with this disclosure. Rather, they are merely examples of apparatus and methods consistent with the aspects disclosed in the present embodiments, as recited in the appended claims.

[0025] see figure 1 , 2 , In the embodiment of the present invention, a laser in-situ auxiliary turning tool includes a tool handle 10, a blade 1 mounted on a mounting surface provided at the front end of the tool handle 10, and a channel for the laser beam to pass through is opened in the tool handle 10. The side of the blade 1 in contact with the mounting surface is inclined as the l...

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Abstract

The invention relates to the technical field of precision machining, in particular to a laser in-situ assisted turning tool and a method for using the same. The laser in-situ assisted turning tool includes a handle and a blade mounted on a mounting surface provided at the front end of the handle. There is a through hole in the handle for the laser beam to pass through, the side of the blade in contact with the mounting surface is inclined as the laser incident surface, the laser incident surface has an included angle with the through hole, and the end of the through hole is far away from the laser incident surface A laser is provided, and the laser beam emitted by the laser passes through the through hole, is refracted by the laser incident surface, and then transmits in situ to the workpiece corresponding to the tip of the blade, so as to preheat the workpiece. The beneficial effect of the present invention is that: the laser in-situ auxiliary turning tool not only realizes in-situ auxiliary heating of the workpiece, but also flexibly adjusts the incident angle of the laser beam by adjusting the relative position of the laser and the through hole.

Description

technical field [0001] The invention relates to the technical field of precision machining, in particular to a laser in-situ auxiliary turning tool and a method for using the same. Background technique [0002] When processing hard and brittle materials such as silicon, germanium, and ceramics that are difficult to process, brittle fracture of the workpiece often occurs during processing due to the high hardness of the material. Using the laser-assisted method, the heating and softening of the workpiece material by the laser can change the processing from brittle processing to plastic cutting, and obtain better processing results. [0003] The existing laser-assisted processing device of Company A is used for laser off-position auxiliary processing. During the processing, the heating and softening of the material by the laser and the cutting of the tool are not in place, that is, the workpiece heated by the laser and the workpiece cut by the tool are not in the same place at...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23B27/00B23K26/00
CPCB23B27/00B23K26/0093
Inventor 石广丰高继雨夏名强毕娇龙邹春阳史国权李俊烨赵伟宏
Owner CHANGCHUN UNIV OF SCI & TECH