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Antenna and processing method thereof

An antenna and power feeding technology, which is applied in the manufacture of antenna array devices, antennas, antenna arrays, etc., can solve the problems of high assembly difficulty, antenna solder joints, many connection points, and large structural complexity, and achieve low assembly difficulty, Guaranteed performance and low structural complexity

Pending Publication Date: 2021-03-12
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, each radiating device 02 and the feeder base 01, as well as the internal parts of the radiating device 02, are assembled by means of welding and structural connection. Large, involving a large number of assembly operations and welding operations, the assembly is difficult, and there are many solder joints and connection points inside the antenna, it is difficult to guarantee the performance indicators of the antenna

Method used

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  • Antenna and processing method thereof
  • Antenna and processing method thereof
  • Antenna and processing method thereof

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Embodiment Construction

[0056] In the first aspect, the embodiment of the present application provides an antenna, such as image 3 and Figure 4 As shown, it includes a feeding base 2 and a plurality of radiation devices 1 arranged on the feeding base 2, and the feeding base 2 is used to feed power to a plurality of radiation devices 1; the radiation device 1 is composed of a first insulating base 11 and attached to The first conductive metal layer 12 is formed on the first insulating base 11, and the feeder base 2 is composed of a plate-shaped second insulating base 21 and a second conductive metal layer 22 attached to the second insulating base 21. The first insulating base 11 and the second insulating base 21 are integrally formed.

[0057] It should be noted that the first conductive metal layer 12 refers to the conductive metal layer used to realize functions such as signal radiation, signal transmission or impedance matching, and the second conductive metal layer 22 refers to the conductive m...

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Abstract

The embodiment of the invention provides an antenna and a processing method thereof, relates to the technical field of antennas, and can reduce the structural complexity and assembly difficulty of theantenna and ensure the performance of the antenna. The antenna comprises a feed bottom plate and a plurality of radiation devices arranged on the feed bottom plate, wherein the feed bottom plate is used for feeding the plurality of radiation devices; the radiation device is composed of a first insulating base body and a first conductive metal layer attached to the first insulating base body, thefeed bottom plate is composed of a plate-shaped second insulating base body and a second conductive metal layer attached to the second insulating base body, and the first insulating base body and thesecond insulating base body are integrally formed. The antenna provided by the embodiment of the invention is used for a multiple-input multiple-output communication system.

Description

technical field [0001] The present application relates to the technical field of antennas, in particular to an antenna and an antenna processing method. Background technique [0002] In the context of 5G mobile communication, the multiple-input and multiple-output (MIMO) communication system puts forward higher requirements on the structure of the antenna. [0003] figure 1 and figure 2 It is an antenna applied to a multiple-input multiple-output communication system in the prior art, such as figure 1 and figure 2 As shown, the antenna includes a feeding base plate 01, a radiation device array and a shielding frame 03. The radiation device array is arranged on the feeding base plate 01. The radiation device array includes a plurality of radiation devices 02 arranged in an array. The radiation device array can realize multi-channel signal Input and multi-channel signal output, the feeder base plate 01 is used to feed power to the radiation device array, and the shieldin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01Q1/50H01Q21/00H01Q21/06
CPCH01Q1/38H01Q1/50H01Q21/0006H01Q21/061H01Q21/0087H01Q25/001H01Q21/26H01Q21/0075H01Q21/24H01Q1/526H01Q1/523
Inventor 张润孝刘子晖章园红周小林李磊
Owner HUAWEI TECH CO LTD
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