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Semiconductor laser and semiconductor laser side pump module

A technology of lasers and semiconductors, applied in the field of lasers, which can solve the problems of laborious installation of laser units

Active Publication Date: 2022-03-29
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a semiconductor laser and a semiconductor laser side pump module, aiming to solve the problem that the laser unit is laborious to install due to the laser unit being inserted into the cavity and adjusting the angle of the laser unit

Method used

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  • Semiconductor laser and semiconductor laser side pump module
  • Semiconductor laser and semiconductor laser side pump module
  • Semiconductor laser and semiconductor laser side pump module

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Embodiment Construction

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] Please also refer to Figure 1 to Figure 5 as well as Figure 7 to Figure 10, the semiconductor laser provided by the present invention will now be described. The semiconductor laser includes an insulating water-cooled plate 1 provided with a water inlet channel 11 and a water outlet channel 12, a plurality of laser units 2, and the plurality of laser units 2 are arranged at intervals along a preset direction, and also includes a positive lead-out plate 3 and a negative lead-out plate. plate 4 and fixing assembly 5 . The positive lead-out plate 3 is a plu...

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Abstract

The invention provides a semiconductor laser and a side pump module of the semiconductor laser, belonging to the technical field of lasers, comprising an insulating water-cooled plate, a plurality of laser units, a positive lead-out plate, a negative lead-out plate and a fixing assembly. The positive lead-out plate penetrates between the insulating water-cooled plate and the positive electrode plate and is provided with two communication holes, with a first exposed portion, and a protruding hole is provided on the second to last first exposed portion along the predetermined direction serial part. The negative lead-out plate is attached to the negative electrode plate and has second exposed parts, and the first to penultimate second exposed parts along the preset direction are bonded to the adjacent serial parts along the preset direction. The fixed assembly and the insulating water-cooled plate clamp all positive lead-out plates, laser units and negative lead-out plates. The semiconductor laser and the semiconductor laser side pump module provided by the present invention can avoid the problem of laborious installation of the laser unit caused by penetrating the laser unit into the cavity and adjusting the angle of the laser unit.

Description

technical field [0001] The invention belongs to the technical field of lasers, and more specifically relates to a semiconductor laser and a semiconductor laser side pump module. Background technique [0002] In existing semiconductor lasers, a plurality of laser units are water-cooled by an insulating water-cooling plate. The side of the insulating water-cooling plate is provided with a water inlet channel and a water outlet channel that are arranged in a straight line and are parallel to each other. There are multiple water outlet holes in the length direction, and there are multiple water inlet holes along the length direction of the water outlet channel on the water outlet channel. The water outlet holes and the water inlet holes are arranged in pairs. Each pair of water outlet holes and water inlet holes corresponds to a laser unit. There are two flow holes, and the laser unit is also provided with heat dissipation holes for communication between the two flow holes. The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/0225H01S5/024H01S5/026
CPCH01S5/02423H01S5/026
Inventor 王媛媛孙奕涛高鹏飞孙芮房玉锁杨红伟
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP