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A magnetic field testing device for semiconductor current density inversion

A technology of current density and testing equipment, which is applied in the field of power semiconductor device testing, and can solve problems such as difficult detection of current density distribution

Active Publication Date: 2022-06-28
TSINGHUA UNIV
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Problems solved by technology

[0003] In order to overcome the defects of the prior art, the present invention provides a magnetic field test device for semiconductor current density inversion, which solves the problem that the existing high-power crimping type semiconductor devices usually have a round cake-shaped or square package sealing structure, which is limited This sealed structure makes it difficult to detect the internal current density distribution

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  • A magnetic field testing device for semiconductor current density inversion
  • A magnetic field testing device for semiconductor current density inversion
  • A magnetic field testing device for semiconductor current density inversion

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Embodiment Construction

[0062] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0063]This embodiment integrates the magnetic field testing device into the magnetic field inversion current calculation method for semiconductor current density analysis. The theoretical basis is: when the cylindrical conductor structure is flowing, if there is an uneven distribution of current density in a thin cylindrical layer, then the magnetic field component at the position of the coplanar concentric circle (such as the radial magnetic field component) will have obvious cha...

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Abstract

The invention provides a magnetic field testing device for semiconductor current density inversion, comprising a magnetic field testing component and a crimping component; the crimping component crimps a semiconductor chip to be tested; The chip measures the magnetic field strength, so as to solve the problem that the existing high-power crimping type semiconductor devices are usually round cake-shaped or square-packaged sealing structures. Limited by this sealing structure, it is difficult to detect the internal current density distribution.

Description

technical field [0001] The invention relates to the field of power semiconductor device testing, in particular to a magnetic field testing device for semiconductor current density inversion. Background technique [0002] With the rapid development of renewable energy and DC power grids, the power conversion technology and current interruption technology based on high-power press-contact semiconductors have been deeply researched and applied. As the core components, the current and voltage levels of high-power press-contact semiconductors are The most important application indicators, generally speaking, high-power press-fit semiconductors are usually used in parallel with multiple cells of the whole wafer or multiple independent chips cut from the wafer in parallel. When the device is disconnected, the current imbalance may occur, which may lead to the failure of the device. At the same time, during the process of maintaining a long-term short-circuit current after failure, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26G01R31/28G01R33/02
CPCG01R31/2601G01R31/28G01R33/02
Inventor 曾嵘周文鹏余占清赵彪吴锦鹏陈政宇
Owner TSINGHUA UNIV
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