Magnetic field testing device for semiconductor current density inversion

Abstract

The invention provides a magnetic field testing device for semiconductor current density inversion. The magnetic field testing device comprises a magnetic field testing assembly and a crimping assembly; the crimping assembly crimps a tested semiconductor chip; and the magnetic field testing assembly is used for measuring the magnetic field intensity of the crimped tested semiconductor chip, so that the problem that the internal current density distribution condition is difficult to detect due to the fact that an existing high-power crimped semiconductor device is generally of a cake-shaped or square packaged sealing structure and is limited by the sealing structure is solved.

Description

technical field [0001] The invention relates to the field of power semiconductor device testing, in particular to a magnetic field testing device for semiconductor current density inversion. Background technique [0002] With the rapid development of renewable energy and DC power grids, power conversion technology and current breaking technology based on high-power crimping semiconductors have been deeply studied and applied. As core components, the current and voltage levels of high-power crimping semiconductors are The most important application index, generally speaking, high-power press-fit semiconductors are usually used in parallel connection of multiple cells of the entire wafer or multiple independent chips cut from the wafer, so in the steady-state flow and transient shutdown of the device When the device is off, the current imbalance may cause the device to fail. At the same time, the device maintains a long-term short-circuit current flow process after the failure...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the defects of the prior art, the present invention provides a magnetic field test device for semiconductor current density inversion, which solves the problem that the existing high-power crimping type semiconductor devices usually have a round cake-shaped or square package sealing structure, which is limited This sealed structure makes it difficult to detect the internal current density distribution

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