Optical identification module

A technology of optical recognition and light through holes, which is applied in biometric recognition, character and pattern recognition, instruments, etc., can solve problems such as light beams are easily scattered and transmitted, poor image quality, and affect recognition results, etc., to improve optical interference , Improve the image resolution, the effect of good recognition ability

Pending Publication Date: 2021-06-18
GUANGZHOU TYRAFOS SEMICON TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the light beam reflected by the object to be measured is easily transmitted to the sensing area scatteredly, resulting in poor image quality and affecting the recognition result
In addition, most of the light emitted by the detection light source (usually the light-emitting pixels of the OLED panel) of the under-display optical identification module is irradiated directly below, so that the sensing area directly below the pixel receives a large amount of light related to the fingerprint. Irrelevant light forms a large noise, which in turn affects the recognition result

Method used

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Embodiment Construction

[0045] In the drawings, each figure illustrates the general characteristics of methods, structure and / or materials used in certain exemplary embodiments. However, the drawings are not limited to the structures or characteristics of the following embodiments, and these drawings should not be interpreted as defining or limiting the scope or nature encompassed by these exemplary embodiments. For example, the relative thicknesses and positions of layers, regions and / or structures may be reduced or exaggerated for clarity.

[0046] The use of similar or identical reference numbers in the various figures is intended to indicate the presence of similar or identical elements or features. Similar reference numerals in the drawings designate similar elements and redundant descriptions thereof will be omitted.

[0047] The optical recognition module listed in the following embodiments is suitable for acquiring the biological characteristics of the object to be tested. The object to be ...

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Abstract

The invention provides an optical identification module. The optical identification module comprises a semiconductor substrate, a plurality of shielding layers and a micro lens, wherein the semiconductor substrate has at least one sensing area. The shielding layers are arranged above the semiconductor substrate, each shielding layer is provided with at least one opening, and the openings of the shielding layers form at least one light through hole, so that external light is obliquely guided to the sensing area through the light through hole. The orthographic projection position of each opening on the semiconductor substrate and the sensing area have a displacement parallel to the semiconductor substrate. The micro lens is arranged on the opening of the shielding layer farthest from the semiconductor substrate in the shielding layers, so that external light is obliquely guided to the sensing area.

Description

technical field [0001] The invention relates to an optical module, in particular to an optical identification module. Background technique [0002] With the vigorous development of Internet of Things technology, the application and demand of biometric technology is expanding rapidly. At present, the common biometric technologies on the market mainly use optical, capacitive or ultrasonic methods to identify biometric features such as fingerprints, palm prints, vein distribution, iris, retina or facial features, so as to achieve the purpose of identity recognition or authentication. Compared with the recognition module that recognizes biometric features by capacitance or ultrasonic waves, the optical recognition module that recognizes biometric features optically receives the light reflected by the object to be measured through the sensing area of ​​the image sensor to identify biometric features. It has the advantages of high durability and low cost. However, the light beam...

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): G06K9/00
CPCG06V40/10
Inventor李仲仁锺建屏
OwnerGUANGZHOU TYRAFOS SEMICON TECH CO LTD