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Optical package structure and method of manufacturing the same

A packaging structure and optical technology, applied in the direction of measuring devices, radiation control devices, using re-radiation, etc., can solve problems such as excessive thickness, thermal expansion coefficient mismatch, substrate warpage, etc.

Pending Publication Date: 2021-07-16
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the optical package has a thickness of at least 1 mm, which may be too thick for some applications
Additionally, the application of multiple materials with different properties in optical packaging may induce substrate warpage due to coefficient of thermal expansion (CTE) mismatch

Method used

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  • Optical package structure and method of manufacturing the same
  • Optical package structure and method of manufacturing the same
  • Optical package structure and method of manufacturing the same

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Embodiment Construction

[0019] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below. Of course, these components and arrangements are examples only and are not intended to be limiting. In the present disclosure, in the following description, the formation or disposition of a first feature over or on a second feature may include an embodiment in which the first feature is formed or disposed in direct contact with the second feature, and may also include Additional features may be formed or disposed between the first and second features such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or configur...

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PUM

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Abstract

An optical package structure includes a substrate, an emitter, a first detector and a light-absorption material. The substrate has a first surface and a second surface opposite to the first surface, the substrate includes a via defining a third surface extending from the first surface to the second surface. The emitter is disposed on the first surface of the substrate. The first detector is disposed on the first surface and aligned with the via of the substrate. The light-absorption material is disposed on the third surface of the substrate.

Description

technical field [0001] The present disclosure relates to an optical packaging structure and a manufacturing method thereof. Background technique [0002] As the technology of semiconductor assemblies such as optical sensor structures has improved, the size of semiconductor assemblies has become much smaller. Typically, an optical package containing one or more time-of-flight (ToF) sensors may utilize an organic substrate and a transparent compound or plastic cover that covers the optical elements on the organic substrate or defines the aperture for such optical elements. optical path. However, the optical package possesses a thickness of at least 1 mm, which may be too thick for some applications. Additionally, the application of multiple materials with different properties in optical packaging may induce substrate warpage due to coefficient of thermal expansion (CTE) mismatch. Therefore, there is a need to reduce thickness and address substrate warpage in order to cater ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L31/02H01L31/0203
CPCH01L31/0203H01L31/02005H01L27/14618H01L27/14636H01L27/14634H01L31/165H01L25/167G01S17/08G01S7/4813H01L31/125H01L31/1804H01L31/153
Inventor 曾吉生柳辉忠黄敬涵
Owner ADVANCED SEMICON ENG INC