High-PID-resistance composite packaging adhesive film and preparation method thereof

A packaging film, high resistance technology, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve degradation and component power attenuation, poor adhesion, failure to pass PID test, etc. problem, achieve the effect of reducing power attenuation and lowering the content of ester group

Pending Publication Date: 2021-08-10
ZHEJIANG SINOPONT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Limited by the material structure of EVA, it is prone to degradation and module power attenuation after aging, so that the double-sided PREC module packaged with it cannot pass the PID test
Double-sided PREC modules are encapsulated with two-layer, three-layer or multi-layer co-extrusion film, which is prone to poor adhesion and delamination after aging

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: A kind of high anti-PID composite encapsulation adhesive film, carries out proportioning according to following percentage:

[0026] EVA resin 40-50%; POE resin 45-60%; compatibilizer 0.01-0.1%; coupling agent 0.04-1.5%; UV absorber 0.1-1%; cross-linking agent 0.1-2%; anti-PID additive 0.01-0.1%.

[0027] EVA resin is an ethylene-vinyl acetate copolymer with a VA content of 18-26% and a melt index of 2-40g / 10min.

[0028] The POE resin is an ethylene-alpha olefin copolymer, one or more of ethylene-butene, ethylene-hexene, and ethylene-octene; the melt index is 2-50 g / 10 min.

[0029] The compatibilizer is one or more of acrylic acid, acrylamide, methyl methacrylate, ethylene-acrylic acid (2-ethylhexyl) copolymer, and glycidyl methacrylate.

[0030] The coupling agent is methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, vinyltrimethoxysilane, vinyltriethoxy One or more of silane and vinylmethyldiethoxysilane.

[0031] Descri...

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PUM

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Abstract

The invention relates to a composite packaging adhesive film, in particular to a high-PID-resistance composite packaging adhesive film and a preparation method thereof. The composition is prepared from the following components in percentage by weight: 40-50% of EVA resin; 45-60% of POE resin; 0.01%-0.1% of a compatilizer; 0.04-1.5% of a coupling agent; 0.1-1% of an ultraviolet absorbent; 0.1-2% of a cross-linking agent; and 0.01-0.1% of an anti-PID auxiliary agent. EVA / POE resin is compounded to serve as a raw material of the packaging adhesive film, so that the content of ester groups in the resin is effectively reduced, and PID power attenuation of a component is reduced; the compatilizer is introduced, so that the EVA / POE resins with different polarities can be well fused, and the problems of delamination and the like in the co-extruded film are completely eradicated; the anti-PID auxiliary agent is added, the optimal proportion is optimized to be 0.05%, and the problem of PID power attenuation of the assembly is solved.

Description

technical field [0001] The invention relates to a composite packaging adhesive film, in particular to a high-PID-resistant composite packaging adhesive film and a preparation method thereof. Background technique [0002] The cost of encapsulating double-sided PREC modules with pure POE film is relatively high. Limited by the material structure of EVA, it is prone to degradation and module power attenuation after aging, so the double-sided PREC module packaged with it cannot pass the PID test. Double-sided PREC modules are encapsulated with two-layer, three-layer or multi-layer co-extrusion film, which is prone to poor adhesion and delamination after aging. Contents of the invention [0003] The present invention mainly solves the deficiencies in the prior art, and provides a high anti-PID compound that uses EVA / POE resin compound as the raw material of the packaging film, effectively reduces the ester group content in the resin, and reduces the PID power attenuation of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J11/06C09J11/04C09J11/08C09J7/30
CPCC09J123/0853C09J123/0815C09J11/06C09J11/04C09J11/08C09J7/30C08L2205/08C08L2203/206C09J2423/04
Inventor 苏丹黄元旦邵佳俊魏晓勇周志英
Owner ZHEJIANG SINOPONT TECH
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