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Display panel, display device and preparation method of display panel

A display panel and substrate technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems affecting the yield rate of MicroLED displays

Active Publication Date: 2021-10-29
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the transfer of Micro LED devices, metal residues are likely to appear in the subsequent manufacturing process, causing the Micro LED devices to be short-circuited and affecting the yield of Micro LED displays.

Method used

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  • Display panel, display device and preparation method of display panel
  • Display panel, display device and preparation method of display panel
  • Display panel, display device and preparation method of display panel

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Embodiment Construction

[0034] Features and exemplary embodiments of various aspects of the invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in order to avoid unnecessarily obscuring the present invention; and, for clarity, the dimensions of some structures may have been exaggerated. Furthermore, the features, structures, or characteristics described hereinafter may be combined in any suitable manner in one or more embodiments.

[0035] In the des...

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PUM

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Abstract

The embodiment of the invention provides a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate; a light-emitting element which is arranged on the substrate, wherein the light-emitting element comprises a first connecting end and a second connecting end which are oppositely arranged in the first direction, and an included angle area exists between the side wall of the light-emitting element and the outer surface of the substrate; an electrode element which is arranged on the substrate and comprises a first contact electrode and a second contact electrode, wherein the first contact electrode is connected to the first connecting end, and the second contact electrode is connected to the second connecting end; and an auxiliary insulation part, wherein at least part of the auxiliary insulation part is located between the first contact electrode and the second contact electrode and is arranged in the included angle area. According to the display panel, short circuit caused by mutual connection of the first contact electrode and the second contact electrode due to metal residues can be improved, and the yield of the display panel is effectively improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel, a display device and a method for preparing the display panel. Background technique [0002] With the continuous development of display technology, people have higher and higher requirements on the service life and display effect of display devices. The light-emitting device of the Micro Light Emitting Diode Display (Micro LED) display is composed of inorganic materials. Compared with the Organic Light Emitting Diode (OLED) display, it has the advantages of high brightness and long life. Therefore, Micro LED displays are gradually becoming the mainstream displays of current display devices. [0003] The Micro LED display is to form the Micro LED device on the sapphire or silicon substrate or other substrates, and then transfer the Micro LED device to the thin film transistor (Thin Film Transistor, TFT) array substrate through the transfer method, so tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/38H01L33/62H01L33/44H01L27/15
CPCH01L33/38H01L33/62H01L33/44H01L27/156H01L2933/0016H01L2933/0025H01L2933/0066
Inventor 陈海晶
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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