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Chemical silver plating solution

A technology of chemical silver plating and silver ions, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem of high level of Giavanni effect, yellowing of silver surface, many holes in copper layer under silver, etc. problems, to achieve the effect of uniform and dense appearance, improve penetration ability, and ensure quality stability

Pending Publication Date: 2022-01-07
深圳市虹喜科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to propose an electroless silver plating solution, which aims to solve the problems of high Giavanni effect level, many holes in the copper layer under the silver, and yellowing of the silver surface in the traditional acid silver plating solution

Method used

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  • Chemical silver plating solution
  • Chemical silver plating solution
  • Chemical silver plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Chemical silver plating solution formula:

[0042]

[0043]

[0044] The silver layer is deposited on the copper layer by using the above electroless silver plating solution to obtain a silver layer with bright surface, bluish white appearance, dense and uniform structure, and no loose holes.

Embodiment 2

[0046] Chemical silver plating solution formula:

[0047]

[0048] The silver layer is deposited on the copper layer by using the above electroless silver plating solution to obtain a silver layer with bright surface, bluish white appearance, dense and uniform structure, and no loose holes.

Embodiment 3

[0050] Chemical silver plating solution formula:

[0051]

[0052]

[0053] The silver layer is deposited on the copper layer by using the above electroless silver plating solution to obtain a silver layer with bright surface, bluish white appearance, dense and uniform structure, and no loose holes.

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PUM

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Abstract

The invention discloses a chemical silver plating solution, which is used for preparing a printed circuit board. The pH value of the chemical silver plating solution is 6 to 8, and the chemical silver plating solution comprises the following components with concentrations: 0.2 to 5.0 g/L of silver ions, 0.01 to 1.0 mol/L of a complexing agent, not less than 1g/L of a surface tension auxiliary agent and less than 0.5 g/L of a stabilizing agent. According to the neutral chemical silver plating solution with the pH of 6 to 8 provided by the invention, in the neutral environment, the chemical silver reaction becomes simpler, only copper is replaced with silver, the reaction that silver is dissolved with nitric acid does not exist, a compact silver layer with few pores can be obtained, the galvanic effect level of the silver layer can be controlled within 5 percent (2 micrometers), the copper layer under silver is few in pores, and the standard of Huawei can be met at 20 [mu] m * 20 [mu] m pad.

Description

technical field [0001] The invention relates to the technical field of printed circuit board preparation, in particular to an electroless silver plating solution. Background technique [0002] In the printed circuit board (PCB) manufacturing process, the conductivity and solderability of the copper surface are improved by silver plating on the copper surface. The silver plating is formed by depositing an electroless silver plating solution on the copper surface. At present, most of the electroless silver plating solutions used for PCB surface coating use acidic silver plating solutions containing nitric acid. When using this silver plating solution to prepare silver layers, there are the following defects: 1. The Giavani effect level is mostly 10-20% (about 5-8μm) range, the silver layer made by it can only barely meet the requirement of less than 20% of the terminal, and there is a big hidden danger; 2. When the existing silver plating solution deposits the silver layer, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42
CPCC23C18/42
Inventor 邱美琴吴旭明蔡良胜曾剑珍田雪峰
Owner 深圳市虹喜科技发展有限公司
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