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Light-emitting device

A light-emitting element and conductive technology, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve the problems of increasing operating voltage, low luminous efficiency, and low reliability, so as to reduce operating voltage, prevent current density, reduce The effect of resistance

Pending Publication Date: 2022-01-18
SEOUL VIOSYS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] If such a phenomenon occurs, no light will be emitted throughout the entire area of ​​the active layer, which may result in low luminous efficiency and low reliability
In order to overcome this problem, there may occur the problem of needing to increase the operating voltage and the problem of requiring additional technology in order to increase the amount of light

Method used

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Examples

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Embodiment Construction

[0046] Hereinafter, the present invention will be described with reference to the drawings. However, the present invention can be embodied in various forms, and therefore is not limited to the embodiments disclosed here. In addition, in order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

[0047] Throughout the specification, when it is mentioned that a certain constituent element is "connected" to other constituent elements, not only the case where these constituent elements are "directly connected" but also the case where other constituent elements are interposed and "indirectly connected" are included. In addition, the so-called "comprising" a certain constituent element does not exclude other constituent elements, but means that other constituent elements may also be included, unless otherwise stated specifically to the co...

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PUM

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Abstract

A light-emitting device according to the invention comprises: a substrate; a first conductive type semiconductor layer disposed on the substrate; a mesa disposed on the first conductive type semiconductor layer and including a second conductive type semiconductor layer and an active layer; a first contact electrode contacting the exposed first conductive type semiconductor layer around the mesa; a second contact electrode contacting the second conductive type semiconductor layer on the mesa; a passivation layer covering the first contact electrode, the mesa, and the second contact electrode and having openings; and first and second bump electrodes electrically connected to the first and second contact electrodes through the openings of the passivation layer, wherein the mesa has a plurality of depressions when viewed from above, the first contact electrode is separated from the mesa at a predetermined distance and formed to surround the mesa and contacts the first conductive type semiconductor layer in the pluraity of depressions, and the first and second bump electrodes cover the openings of the passivation layer and a part of the passivation layer.

Description

[0001] This application is a divisional application of the patent application with the filing date of January 11, 2017, the application number of 201780006654.7, and the title of "ultraviolet light-emitting element". technical field [0002] The invention relates to a light-emitting element, in particular to a light-emitting element capable of improving light extraction efficiency. Background technique [0003] Recently, in order to improve luminous efficiency and solve heat dissipation problems, attention is increasing on light-emitting elements in the form of flip chips. [0004] Compared with the conventional light-emitting elements, the light-emitting element of the flip-chip structure has higher heat dissipation efficiency and almost no light shielding, so it has the effect of improving the light efficiency by more than 50% compared with the existing light-emitting elements. However, even with such advantages, the flip-chip light-emitting element may have the following ...

Claims

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Application Information

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IPC IPC(8): H01L33/38H01L33/40H01L33/44H01L33/46H01L33/62
CPCH01L33/382H01L33/44H01L33/46H01L33/405H01L33/62H01L24/81H01L33/02H01L33/38H01L33/48H01L2924/12041H01L33/486
Inventor 张成逵赵弘锡李圭浩印致贤
Owner SEOUL VIOSYS CO LTD
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