Dual-channel cooling device for semiconductor laser

A cooling device and laser technology, applied in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of overheating damage of semiconductor lasers, insufficient heat dissipation efficiency of heat sinks, poor stability and adaptability, etc., to improve heat dissipation and cooling efficiency, accelerate Heat dissipation and cooling efficiency, stable heat dissipation and cooling effect

Pending Publication Date: 2022-03-22
山东宝鑫达电子科技有限公司
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as far as the current cooling devices of semiconductor lasers are concerned, most of them are heat sink structures, which guide the heat emitted by the semiconductor laser into the interior of the heat sink for natu

Method used

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  • Dual-channel cooling device for semiconductor laser
  • Dual-channel cooling device for semiconductor laser
  • Dual-channel cooling device for semiconductor laser

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Example Embodiment

[0036] Example: Please refer to Figure 1 to 8 :

[0037] The present invention proposes a two-channel cooling device for a semiconductor laser comprising: frame body assembly 1; frame body assembly 1 includes a frame 101 and a heat sink 102, and a heat sink 102 is fixedly mounted on top of the mounting frame 101; semiconductor laser 2 The semiconductor laser 2 is fixedly mounted on the top of the heat sink 102; the heat dissipation cooling assembly includes a cooling mechanism 3 and a circulating mechanism 4, and the cooling mechanism 3 includes a heat dissipation fan 301 and a guide plate 302, a heat dissipation fan 301 fixed mounting The inside of the mounting frame 101 is attached to the inside of the mounting frame 101; the circulation mechanism 4 includes a circulating cooling box 401, and the circulating cooling box 401 is fixedly mounted on the side of the mounting frame 101, and the interior of the circulating cooling box 401 It has a coolant.

[0038] Further, according t...

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Abstract

The invention provides a dual-channel cooling device for a semiconductor laser, and relates to the technical field of cooling devices. The heat dissipation base is fixedly installed at the top of the installation frame, the heat dissipation cooling assembly can greatly improve the heat dissipation cooling efficiency of the semiconductor laser, and the circulation mechanism can greatly reduce the temperature of airflow blown out by the top heat dissipation fan through cooling liquid, so that the heat dissipation efficiency of the heat dissipation base is improved through low-temperature airflow, and the heat dissipation efficiency of the semiconductor laser is improved. And the bottom heat dissipation fan can dissipate heat of the cooling liquid through the cooling channel, so that the temperature rise amplitude of the cooling liquid is reduced, the cooling liquid can be kept within a certain temperature range, and the semiconductor laser can be used for a long time. According to the invention, the problems of low cooling efficiency and overheat damage of the semiconductor laser easily caused by insufficient heat dissipation efficiency due to the fact that heat dissipated by the semiconductor laser is guided into the heat dissipation seat for natural cooling by the heat dissipation device are solved.

Description

technical field [0001] The invention relates to the technical field of cooling devices, in particular to a dual-channel cooling device for semiconductor lasers. Background technique [0002] Semiconductor lasers are lasers that use semiconductor materials as working substances. They are widely used in laser processing, laser medical treatment, laser display and scientific research. Semiconductor lasers are generally used in conjunction with heat sinks to realize the cooling function of semiconductor lasers. [0003] However, as far as the current cooling devices of semiconductor lasers are concerned, most of them are heat sink structures, which guide the heat emitted by the semiconductor laser into the interior of the heat sink for natural cooling, and the cooling efficiency is slow and incomplete. Insufficient heat dissipation efficiency can easily lead to overheating and damage to the semiconductor laser, poor stability and adaptability, and low practicability. Contents ...

Claims

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Application Information

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IPC IPC(8): H01S5/024
CPCH01S5/02407H01S5/02423H01S5/02476
Inventor 宗传坤
Owner 山东宝鑫达电子科技有限公司
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