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Optical module

A technology of optical module and light beam, which is applied in the field of optical communication, can solve the problems of low modulation speed and small wavelength tuning range, and achieve the effect of high integration

Pending Publication Date: 2022-07-29
HISENSE BROADBAND MULTIMEDIA TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides an optical module to solve the problems of small wavelength tuning range and low modulation speed of high-speed tunable lasers in current optical modules

Method used

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Embodiment Construction

[0032] In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described The embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present application.

[0033] One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers / optical waveguides. The passive transmission charact...

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Abstract

The invention discloses an optical module, which comprises a circuit board and a silicon optical chip electrically connected with the circuit board, and is characterized in that the silicon optical chip receives a plurality of light beams with different wavelengths emitted by a semiconductor gain chip on the circuit board and carries out filtering resonance and electro-optical modulation on the light beams; the silicon optical chip comprises an input / output coupler, an optical waveguide, a plurality of filters, a plurality of heaters, a reflector and a high-speed modulator. The input coupler receives light beams emitted by the semiconductor gain chip. The plurality of filters are used for carrying out wavelength screening on the plurality of received light beams; the reflector is used for partially reflecting and partially transmitting the light beams after wavelength screening; the plurality of heaters are respectively arranged on the optical waveguide and the filter and are used for changing the refractive indexes of the optical waveguide and the filter; the high-speed modulator is used for loading an electric signal to the light beam output by the reflector; and the output coupler is used for coupling the signal light output by the high-speed modulator to the optical fiber. The ultra-wide wavelength tuning range and electro-optical high-speed modulation are realized based on the silicon photon integration platform.

Description

technical field [0001] The present application relates to the technical field of optical communication, and in particular, to an optical module. Background technique [0002] With the development of new business and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of photoelectric signals, and it is one of the key components in the optical communication equipment. With the development of the optical communication technology, the transmission rate of the optical module continues to increase. [0003] In the 5G fronthaul application, the high-speed wavelength tunable optical module is one of the important components of the system, and the high-speed wavelength tunable chip as the core of the module determines the performance and communication capacity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/40H04B10/572H04B10/25G02B6/42
CPCH04B10/40H04B10/572H04B10/25G02B6/4287G02B6/428G02B6/4286G02B6/4214G02B6/42H01S5/10
Inventor 隋少帅高凤陈思涛尹延龙赵其圣
Owner HISENSE BROADBAND MULTIMEDIA TECH
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