Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board

一种感光性树脂、制造方法的技术，应用在感光性树脂组合物领域，能够解决耐显像液性降低、掩蔽可靠性降低、缩短显像时间等问题，达到防止不良导通、掩蔽可靠性优良、降低残渣的发生性的效果

Inactive Publication Date: 2005-11-23
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the hydrophilicity of the photosensitive resin composition is increased, the developing solution resistance will decrease, so there is a tendency for the cracking of the mask to increase, that is, the reliability of the mask to decrease.
Therefore, there is no photosensitive resin composition that not only shortens the development time, but also fully satisfies the masking reliability.

Method used

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  • Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board
  • Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board
  • Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

example 1～8

[0111] The materials shown in Table 1 were mixed to obtain a solution. Next, the (B) component shown in Table 2 and Table 3 was dissolved in the obtained solution, and the solution of the photosensitive resin composition was obtained.

[0112] Material

[0113] Material

[0114] Material

[0115] In addition, the materials used in Table 2 and Table 3 are described below.

[0116] FA024M: R=methyl, m in the above general formula (IV) 3 =n 2 =n 3 = 6 (average value) compound (trade name manufactured by Hitachi Chemical Industry Co., Ltd.), molecular weight 1282, number of units of alkylene glycol having 2 to 6 carbon atoms 18

[0117] FA-023M: In the above general formula (III), R=methyl, m 1 = m 2 = 2 (mean value), n 1 = 12 (average value) compound (trade name manufactured by Hitachi Chemical Industry Co., Ltd.), molecular weight 1194, number of units of alkylene glycol having 2 to 6 carbon atoms 16

[0118] HEMA-9P: R=hydrogen atom, m in...

example 9

[0138] With methacrylic acid / methyl methacrylate / ethyl acrylate / styrene copolymer (20 / 57 / 21 / 2 (weight ratio)), weight average molecular weight=60000, 60% by weight methylcellosolve / toluene= 6 / 4 (weight ratio) solution 105g (solid content 64g), FA-024M 36g, 1,7-bis(9-acridylheptane) 0.4g, N,N'-tetraethyl-4,4'- Diaminobenzophenone 0.04g, light crystal violet 0.9g, tribromomethyl phenylsulfone 1.3g, malachite green 0.05g, acetone 12.0g, toluene 5.0g and methanol 3.0g to obtain a solution.

[0139] Then the solution of the obtained photosensitive resin composition is uniformly coated on a 16 μm thick polyethylene terephthalate film (trade name G2-16, manufactured by Teijin Co., Ltd.). After drying with a drier for 10 minutes, it was protected with a protective film made of polyethylene (trade name: NF-13, manufactured by Tamapoli Co., Ltd.), and a photosensitive resin composition laminate was obtained. The film thickness of the photosensitive resin composition layer after drying ...

example 10

[0141] Coordinate methacrylic acid / methyl methacrylate / ethyl acrylate copolymer (17.5 / 52.5 / 30 (weight ratio)), weight-average molecular weight=80000, 60% by weight methyl cellosolve / toluene=6 / 4 (weight ratio) solution 89g (solid content 53g), methacrylic acid / methyl methacrylate / butyl acrylate / butyl methacrylate copolymer (24 / 44 / 15 / 17), weight average molecular weight = 30000, 60 weight % methylcellosolve / toluene=6 / 4 (weight ratio) solution 19g (solid content 11g), FA-024M 36g, 1,7-bis(9-acridylheptane) 0.4g, N,N'- Tetraethyl-4,4'-diaminobenzophenone 0.04g, pale crystal violet 0.9g, tribromomethyl phenyl sulfone 1.3g, malachite green 0.05g, acetone 12.0g, toluene 5.0g and methanol 3.0g , to obtain a solution.

[0142] Then the solution of the obtained photosensitive resin composition is uniformly coated on a 16 μm thick polyethylene terephthalate film (trade name G2-16, manufactured by Teijin Co., Ltd.). After drying with a drier for 10 minutes, it was protected with a...

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PUM

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Abstract

A photosensitive resin composition is here disclosed which satisfies the following (1) and (2): (1) when a 1.0 wt % aqueous sodium carbonate solution is sprayed by a spray on a layer of the photosensitive resin composition having a thickness of 37 to 42 mum under the following conditions, the photosensitive resin composition layer being able to be removed within 20 seconds, the above conditions being that an internal diameter of a nozzle of the spray is 1.2 mm, a spraying pressure is 0.05 MPa, and a distance between a point of the spray nozzle which is closest to the photosensitive resin composition layer and the photosensitive resin composition layer is 50 mm; and (2) when the 1.0 wt % aqueous sodium carbonate solution is sprayed three times for 36 seconds under the above conditions on a cured film obtained by laminating a layer of the photosensitive resin composition having the above thickness on a copper-clad laminate having 18 three-continuous holes in which 3 holes each having a diameter of 6 mm are continuously integrated and which has a length of 16 mm, and then photo-curing the layer with an exposure capable of curing 24 steps in a 41-step tablet, the number of holes where the cured film is broken being 5 or less.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photosensitive element, a method for producing a protective layer pattern, and a method for producing a printed wiring board. Background technique [0002] In the manufacturing method of the printed circuit wiring board, there are two kinds of masking method and plating method. In the masking method, a protective layer is used to protect the copper via holes for mounting connectors, and the circuit is formed by etching and peeling off the protective film. In contrast, in the plating method, copper is deposited in the through hole by electroplating, solder is plated for protection, and the circuit is formed by peeling off the protective layer and etching. [0003] Among these methods, a photosensitive resin composition and a photosensitive element are used as a protective layer, and an alkali-developing type protective layer is mainly used from the viewpoint of running cost and work...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/031G03F7/32H05K3/00H05K3/06
CPCG03F7/031H05K3/0073H05K3/0094H05K2203/0793H05K2203/1394G03F7/027H05K2203/0769G03F7/322H05K3/064Y10S430/121
Inventor 深谷雄大远藤昌树阿部卓治板垣胜俊
Owner RESONAC CORPORATION
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