23results about "Circuit masks" patented technology

A method for producing an electronic component comprises steps of providing a carrier in which conductor tracks and a contact structure are arranged on an upper side of the carrier, removing part of the material of the carrier on the upper side of the carrier in order to create a cavity with a recessed upper side in an environment of the contact structure such that the contact structure is raised above the recessed upper side, arranging a semiconductor chip above the contact structure, and establishing an electrically conductive connection between the contact structure and the semiconductor chip.

The invention discloses a selective exposure technical method which comprises the following steps: S1, unit plate marking: detecting a unit plate, and marking a groove mark on a scrapped area of the unit plate; s2, pattern transfer: separating the unit plates with scrap mark grooves, carrying out independent layering on the unit plates by exposure personnel, and then carrying out exposure processing on the unit plates; and S3, exposure processing: selecting an LDI machine or a single PCS negative film for selective exposure. According to the method, in the manufacturing process of the circuit board, the scrapped areas are identified uniformly after passing through the inspection stations, and selective exposure is carried out on the scrapped areas in the pattern transfer process, so that the waste of cost and efficiency on the scrapped units in the subsequent process of manufacturing the scrapped units is avoided.

Reusable composite stencils for spray processes, particularly for spray processes used in the fabrication of integrated circuit devices, may be fabricated having a permanent core and at least one sacrificial material layer. Thus, in operation, when a predetermined amount of the sacrificial material layer has been ablated away by a material being sprayed in the spray process, the remaining sacrificial material layer may be removed and reapplied to its original thickness. Therefore, the permanent core, which is usually expensive and / or difficult to fabricate, may be repeatedly reused.

The present invention discloses a composite structure of a thin film sensor insulating layer based on a metal substrate, comprising a metal substrate layer, an adhesive layer arranged on the metal substrate layer, a first insulating layer arranged on the adhesive layer, a second insulating layer arranged on the first insulating layer, a third insulating layer arranged on the second insulating layer, a sensor circuit layer arranged on the third insulating layer, and a protective layer covering the third insulating layer and the sensor circuit layer is arranged or not arranged on the third insulating layer. In the present invention, since the silicon nitride insulating layer does not contact the metal substrate, the possibility of it reacting with the metal substrate in a high temperature environment is eliminated; at the same time, due to the isolation of the silicon nitride insulating layer, the pinholes in the aluminum oxide insulating layer are blocked, so that a short circuit between the sensor circuit layer and the metal substrate will not be caused, thereby ensuring the insulation ability of the thin film sensor based on the metal substrate when used in a high temperature environment.

The present disclosure provides an insulating layer for a multilayer printed circuit board, a multilayer printed circuit board including the same, and a method for fabricating the same. The insulating layer of the present disclosure includes a polymer resin layer containing a melamine derivative, and thus may have excellent adhesion to a patterned metal layer.

The application discloses a kind of FCBGA pattern exposure processes, comprising: step A: on circuit board, drill through hole;Step B: resin hole machine is used to resin hole to form resin hole to through hole with resin plug hole, wherein, resin hole inside contains resin material for protecting through hole;Step C: determine cutting area on the jig identical with the shape of circuit board, cutting area is carried out to cutting area, wherein, cutting area is the area corresponding to jig and resin hole;Step D: the jig is placed on the surface of thickening layer, and the thickening layer is cut along the edge of jig, so that the shape of thickening layer is identical with the shape of jig;Step E: the thickening layer is covered on the surface of circuit board, and the surface of circuit board forms exposed area not covered by thickening layer, and resin hole is located in exposed area;Step F: resin hole is used as the positioning hole of LDI exposure, and the circuit board after being attached to thickening layer is subjected to LDI exposure, and the application can improve the accuracy of LDI alignment, and improve production efficiency.

The present invention discloses a method for manufacturing a gold-plated circuit board, comprising: providing a substrate, wherein the substrate includes a central region and an edge region, a plurality of gold-plated connection pads arranged in an array are provided in the central region, the plurality of gold-plated connection pads arranged in the array are connected in series with each other through leads, at least one gold-plating auxiliary connection pad is provided in the edge region, and the gold-plating auxiliary connection pad is connected in series with the gold-plated connection pads in the central region through leads; providing a gold-plating barrier film on the surface of the substrate, the gold-plating barrier film covering non-gold-plated regions other than the gold-plated connection pads and the gold-plating auxiliary connection pads; performing gold plating on the gold-plated connection pads and the gold-plating auxiliary connection pads; removing the gold-plating barrier film and the leads in the central region; and removing the edge region. The present invention can avoid the gold-plated connection pads from being charred by the initial current.

The invention relates to a method for manufacturing an interconnection level comprising a metallic line (62) and a metallic via (61), comprising: • forming, on a substrate (S), a first dielectric layer (21), • forming, on the first dielectric layer (21), a structured etching stop layer (30) comprising a first line pattern (301) and a via opening (30v), • forming, on the etching stop layer, a second dielectric layer (22), • forming, on the second dielectric layer (22), a second mask (40) defining a second line pattern (401) aligned with the first line pattern (301), • etching the second and first dielectric layers (22, 21), configured to form upper and lower cavities (50sup, 50inf) respectively, • filling the lower and upper cavities (50inf, 50sup) to form the metallic line (62) and the metallic via (61).

The invention provides a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern, and a method for manufacturing a printed wiring board. The photosensitive resin composition according to the present invention contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, and in the photosensitive resin composition, the binder polymer contains a structural unit derived from a (meth) acrylate compound having a dicyclopentyl group, and the weight molecular weight of the binder polymer is 7500-23000.

A mask device includes a mesh mask and a metal mask disposed under the mesh mask. The mesh mask includes a mesh pattern and a plurality of first blocking portions disposed in the mesh pattern to block portions of the mesh pattern, the metal mask includes a plurality of second blocking portions overlapping the first blocking portions in a plan view, and the metal mask is provided with an accommodation opening defined through in the metal mask, and not overlapping the first blocking portions in a plan view.

The present disclosure is titled "Printed Circuit Board Trace for Reducing Janning Effect." Apparatuses and methods for reducing etching within a printed circuit board due to the Janning effect are described, which can be used, for example, in a data storage device, such as a card-type data storage device. Specifically, a contact trace is coupled to a contact finger, which has a substantially greater surface area than the contact trace and is configured to couple the data storage device to a host device. The contact trace is electrically isolated from the rest of the circuit during the manufacturing process. The contact finger and an exposed portion of the contact trace are plated with a common material to reduce Janning etching of the contact trace during manufacturing. The contact trace is then connected to an impedance trace by at least one of a component and a bond wire.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

To provide a photosensitive element capable of reducing the number of defects generated in a resist pattern.SOLUTION: A photosensitive element comprises a support film, a barrier layer, and a photosensitive layer in the stated order, wherein the number of particles having a diameter of at least 0.8 μm as measured on the barrier layer-side surface of the support film is at most 100 per 0.0225 mm2.SELECTED DRAWING: Figure 1

The present application discloses a multilayer circuit board and a manufacturing method thereof, and a display module. Different from the existing multilayer circuit board in which two adjacent circuit layers are electrically connected by physically punching holes in a PCB board, the multilayer circuit board in which two adjacent circuit layers are electrically connected is achieved through a plurality of through holes filled with metal materials in a positive photoresist layer. Since a plurality of through holes penetrating the positive photoresist layer can be formed in batches through a single photolithography process, the positive photoresist layer between two adjacent circuit layers can be punched in batches, which is highly efficient and low in cost. Furthermore, the through holes penetrating the positive photoresist layer are not prone to residual debris, so that the two adjacent circuit layers can be effectively connected. The aperture of the through hole is also relatively uniform, and the aperture size can be relatively small, which is beneficial to improving the display effect of MiniLED and Micro LED and realizing miniaturization and thin design.

A method for manufacturing an interconnecting level includes providing a substrate having a connecting terminal, forming a first dielectric layer on the substrate, and forming and structuring an etching stop layer on the first dielectric layer to define a first line pattern including a via opening. A second dielectric layer is formed on the etching stop layer, and a second mask defining a line pattern aligned with the first line pattern is formed. The dielectric layers are etched to form upper and lower cavities, which are filled with a metal material to form a metal line and a metal via connected to the connecting terminal.

The invention relates to a method for processing a bevel edge of a golden finger area of a printed circuit board, which sequentially comprises the following steps of: A, resistance welding and windowing: windowing a golden finger body and an adjacent lead area in a resistance welding process, and exposing a copper surface of the area; b, conducting wire area etching: completely removing the copper layer of the adjacent conducting wire area on the outer side of the golden finger body through a graphical etching process; and C, bevel edge forming: performing bevel edge cutting along the copper-free isolation strip formed by etching in the lead area, wherein the cutting boundary ends at the copper-free isolation strip and is far away from the golden finger body. The metal exposure risk during bevel edge cutting is thoroughly eliminated through the copper-free isolation strip, and an electrochemical migration path is blocked; no metal contact exists in the whole cutting process, conductive chippings are completely eradicated, and the hidden danger of short circuit in a high-frequency plugging scene is solved; the isolation belt design is compatible with conventional equipment precision, and the process error-tolerant rate and reliability are improved.

The invention belongs to the technical field of circuit board processing, and particularly relates to developing equipment and process for a circuit board, and the developing equipment comprises a rack, a conveying unit, a partition developing unit, an ultrasonic auxiliary unit, an online detection unit, a developing solution recycling unit, a temperature and pressure control unit and a central control system; the conveying unit, the partition developing unit, the ultrasonic auxiliary unit, the online detection unit, the developing solution recycling unit and the temperature and pressure control unit are all mounted on the rack and are electrically connected with the central control system; a'pre-developing-main developing-fine developing 'gradient parameter system is constructed through the partition developing unit, and is matched with a matrix type spray head capable of adjusting angles in a stepless manner, and the accurate matching of developing solution concentration, spraying pressure and ultrasonic energy is realized by combining the frequency dynamic adaptive design of the ultrasonic auxiliary unit.

The present invention discloses an embedded thin film sensor, including a metal substrate layer, a substrate adhesive layer, an insulating layer, an upper adhesive layer, a seed layer, and a packaging layer connected in sequence, wherein the sensor circuit layer is embedded in the insulating layer, and the pads of the sensor circuit are exposed for connection. The present invention adopts an embedded structure to fully protect the sensor and meet the use under more severe conditions; the composite structure of the insulating layer not only solves the problem that aluminum oxide deposited by electron beam evaporation alone cannot achieve the insulating function as the insulating layer, but also solves the problem that silicon nitride deposited by plasma enhanced chemical vapor deposition alone is easy to react with the metal substrate under high temperature conditions and cause insulation failure, but also solves the problem of a large amount of time and cost spent on depositing a certain thickness of insulating layer by atomic layer deposition in response to high temperature conditions, and the atomic layer deposition of aluminum oxide with a thickness of 10-500nm is within the normal range; the protective layer manufacturing process is simple, time-saving, cost-effective, and high-strength.

A method for producing an electronic component comprises steps of: providing a carrier, in which conductor tracks and a contact structure are positioned on a top side of the carrier; removing part of the material of the carrier on the top side of the carrier in order to create a cavity with a recessed top side in a vicinity of the contact structure, such that the contact structure is raised above the recessed top side; positioning a semiconductor chip above the contact structure; and establishing an electrically conductive connection between the contact structure and the semiconductor chip.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

An apparatus and method for manufacturing a power module is provided. The power module includes: a circuit board having a metal pattern formed thereon; a terminal coupled to the circuit board and electrically connected to at least a portion of the metal pattern; a power device chip bonded to the circuit board and electrically connected to at least a portion of the metal pattern and the terminal; and a molding part covering the power device chip and the circuit board. The circuit board includes: a base part comprising an insulating material; a pattern layer disposed on at least one of an upper surface and a lower surface of the base part and providing the metal pattern; and a thin film resistor having a predetermined circuit pattern connecting the metal patterns disposed on the base part to each other.

The present disclosure provides an insulating layer for a multilayer printed circuit board, a multilayer printed circuit board including the same, and a method for manufacturing the same. The insulating layer of the present disclosure includes a polymer resin layer including a melamine derivative, and thus can have excellent adhesion to a patterned metal layer.

The embodiment of the application discloses a kind of inkjet printing method and the preparation method of PCB board, inkjet printing method includes: providing substrate;Inkjet printing phase change ink on the surface of substrate, form first graphic layer;Inkjet printing non-phase change ink on the side of first graphic layer away from substrate, form second graphic layer;Wherein, the inkjet printing area of non-phase change ink at least with the edge region of first graphic layer overlaps;First graphic layer combines second graphic layer and forms preset printing layer of layer. Reduce the cost of process technology, and improve the preparation efficiency, improve the smoothness of the edge of preset printing layer of layer simultaneously.