7results about "Circuit masks" patented technology

Reusable composite stencils for spray processes, particularly for spray processes used in the fabrication of integrated circuit devices, may be fabricated having a permanent core and at least one sacrificial material layer. Thus, in operation, when a predetermined amount of the sacrificial material layer has been ablated away by a material being sprayed in the spray process, the remaining sacrificial material layer may be removed and reapplied to its original thickness. Therefore, the permanent core, which is usually expensive and / or difficult to fabricate, may be repeatedly reused.

The application discloses a kind of FCBGA pattern exposure processes, comprising: step A: on circuit board, drill through hole;Step B: resin hole machine is used to resin hole to form resin hole to through hole with resin plug hole, wherein, resin hole inside contains resin material for protecting through hole;Step C: determine cutting area on the jig identical with the shape of circuit board, cutting area is carried out to cutting area, wherein, cutting area is the area corresponding to jig and resin hole;Step D: the jig is placed on the surface of thickening layer, and the thickening layer is cut along the edge of jig, so that the shape of thickening layer is identical with the shape of jig;Step E: the thickening layer is covered on the surface of circuit board, and the surface of circuit board forms exposed area not covered by thickening layer, and resin hole is located in exposed area;Step F: resin hole is used as the positioning hole of LDI exposure, and the circuit board after being attached to thickening layer is subjected to LDI exposure, and the application can improve the accuracy of LDI alignment, and improve production efficiency.

The invention relates to a method for manufacturing an interconnection level comprising a metallic line (62) and a metallic via (61), comprising: • forming, on a substrate (S), a first dielectric layer (21), • forming, on the first dielectric layer (21), a structured etching stop layer (30) comprising a first line pattern (301) and a via opening (30v), • forming, on the etching stop layer, a second dielectric layer (22), • forming, on the second dielectric layer (22), a second mask (40) defining a second line pattern (401) aligned with the first line pattern (301), • etching the second and first dielectric layers (22, 21), configured to form upper and lower cavities (50sup, 50inf) respectively, • filling the lower and upper cavities (50inf, 50sup) to form the metallic line (62) and the metallic via (61).

The invention provides a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern, and a method for manufacturing a printed wiring board. The photosensitive resin composition according to the present invention contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, and in the photosensitive resin composition, the binder polymer contains a structural unit derived from a (meth) acrylate compound having a dicyclopentyl group, and the weight molecular weight of the binder polymer is 7500-23000.

A method for manufacturing an interconnecting level includes providing a substrate having a connecting terminal, forming a first dielectric layer on the substrate, and forming and structuring an etching stop layer on the first dielectric layer to define a first line pattern including a via opening. A second dielectric layer is formed on the etching stop layer, and a second mask defining a line pattern aligned with the first line pattern is formed. The dielectric layers are etched to form upper and lower cavities, which are filled with a metal material to form a metal line and a metal via connected to the connecting terminal.

The invention belongs to the technical field of circuit board processing, and particularly relates to developing equipment and process for a circuit board, and the developing equipment comprises a rack, a conveying unit, a partition developing unit, an ultrasonic auxiliary unit, an online detection unit, a developing solution recycling unit, a temperature and pressure control unit and a central control system; the conveying unit, the partition developing unit, the ultrasonic auxiliary unit, the online detection unit, the developing solution recycling unit and the temperature and pressure control unit are all mounted on the rack and are electrically connected with the central control system; a'pre-developing-main developing-fine developing 'gradient parameter system is constructed through the partition developing unit, and is matched with a matrix type spray head capable of adjusting angles in a stepless manner, and the accurate matching of developing solution concentration, spraying pressure and ultrasonic energy is realized by combining the frequency dynamic adaptive design of the ultrasonic auxiliary unit.

An apparatus and method for manufacturing a power module is provided. The power module includes: a circuit board having a metal pattern formed thereon; a terminal coupled to the circuit board and electrically connected to at least a portion of the metal pattern; a power device chip bonded to the circuit board and electrically connected to at least a portion of the metal pattern and the terminal; and a molding part covering the power device chip and the circuit board. The circuit board includes: a base part comprising an insulating material; a pattern layer disposed on at least one of an upper surface and a lower surface of the base part and providing the metal pattern; and a thin film resistor having a predetermined circuit pattern connecting the metal patterns disposed on the base part to each other.