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Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board

A technology of photosensitive resin and manufacturing method, applied in the field of photosensitive resin composition, can solve the problems of reduced pit reliability, reduced developing solution resistance, shortened developing time, etc., achieves excellent pit reliability, prevents Excellent effect of poor conduction and pit reliability

Inactive Publication Date: 2003-07-23
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the hydrophilicity of the photosensitive resin composition is increased, the developer resistance will be reduced, so there is a tendency that the cracking of the pits increases, that is, the reliability of the pits decreases.
Therefore, there is no photosensitive resin composition that not only shortens the developing time, but also fully satisfies the reliability of pits.

Method used

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  • Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

example 1～8

[0101] The materials shown in Table 1 were mixed to obtain a solution. Next, the (B) component shown in Table 2 and Table 3 was dissolved in the obtained solution, and the solution of the photosensitive resin composition was obtained.

[0102] Material

Cooperate

①

②

(A)

become

Minute

Methacrylic acid / methyl methacrylate / ethyl acrylate / styrene copolymer

(20 / 57 / 21 / 2 (weight ratio)), weight average molecular weight=60000, 60% by weight

Methyl cellosolve / toluene=6 / 4 (weight ratio) solution, dispersion=2.5

89

(solid state

Composition 53)

89

(solid state

Composition 53)

Methacrylic acid / methyl methacrylate / butyl acrylate / butyl methacrylate

Copolymer (24 / 44 / 15 / 17 (weight ratio)), weight average molecular weight=30000, 60

Weight % methylcellosolve / toluene=6 / 4 (weight ratio) solution, dispersion=2.0

19

(solid state

Ingredients 11)

19

(solid state

Ing...

example 10

[0130] Coordinate methacrylic acid / methyl methacrylate / ethyl acrylate copolymer (17.5 / 52.5 / 30 (weight ratio)), weight-average molecular weight=80000, 60% by weight methyl cellosolve / toluene=6 / 4 (weight ratio) solution 89g (solid content 53g), methacrylic acid / methyl methacrylate / butyl acrylate / butyl methacrylate copolymer (24 / 44 / 15 / 17), weight average molecular weight = 30000, 60 weight % methylcellosolve / toluene=6 / 4 (weight ratio) solution 19g (solid content 11g), FA-024M 36g, 1,7-bis(9-acridylheptane) 0.4g, N,N'- Tetraethyl-4,4'-diaminobenzophenone 0.04g, pale crystal violet 0.9g, tribromomethyl phenyl sulfone 1.3g, malachite green 0.05g, acetone 12.0g, toluene 5.0g and methanol 3.0g , to obtain a solution.

[0131] Then the solution of the obtained photosensitive resin composition is uniformly coated on a 16 μm thick polyethylene terephthalate film (trade name G2-16, manufactured by Teijin Co., Ltd.). After drying with a drier for 10 minutes, it was protected with a...

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PUM

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Abstract

A photosensitive resin composition is here disclosed which satisfies the following (1) and (2): (1) when a 1.0 wt % aqueous sodium carbonate solution is sprayed by a spray on a layer of the photosensitive resin composition having a thickness of 37 to 42 mum under the following conditions, the photosensitive resin composition layer being able to be removed within 20 seconds, the above conditions being that an internal diameter of a nozzle of the spray is 1.2 mm, a spraying pressure is 0.05 MPa, and a distance between a point of the spray nozzle which is closest to the photosensitive resin composition layer and the photosensitive resin composition layer is 50 mm; and (2) when the 1.0 wt % aqueous sodium carbonate solution is sprayed three times for 36 seconds under the above conditions on a cured film obtained by laminating a layer of the photosensitive resin composition having the above thickness on a copper-clad laminate having 18 three-continuous holes in which 3 holes each having a diameter of 6 mm are continuously integrated and which has a length of 16 mm, and then photo-curing the layer with an exposure capable of curing 24 steps in a 41-step tablet, the number of holes where the cured film is broken being 5 or less.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photosensitive element, a method for producing a protective layer pattern, and a method for producing a printed wiring board. Background technique [0002] In the manufacturing method of the printed circuit wiring board, there are two kinds of recessing method and plating method. In the recess method, a protective layer is used to protect the copper through hole for mounting the connector, and the circuit is formed by etching and peeling off the protective film. In contrast, the plating method deposits copper in the through hole by electroplating, plating with solder for protection, peeling off the protective layer, and etching to form a circuit. [0003] Among these methods, a photosensitive resin composition and a photosensitive element are used as a protective layer, and an alkali-developing type protective layer is mainly used from the viewpoint of running cost and working envi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/031G03F7/32H05K3/00H05K3/06
CPCG03F7/031H05K3/0073H05K3/0094H05K2203/0793H05K2203/1394G03F7/027H05K2203/0769G03F7/322H05K3/064Y10S430/121
Inventor 深谷雄大远藤昌树阿部卓治板垣胜俊
Owner RESONAC CORPORATION
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