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Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad

A PCB board and window opening technology, which is applied in the field of PCB board manufacturing, can solve problems such as ink or ink solvent residue, and achieve the effect of improving production efficiency

Inactive Publication Date: 2016-08-31
LONGTENG ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of the prior art, and provides a method for preventing the ink on the pad in the plug hole of the PCB with a window on one side, which can solve the problem that the ink or ink solvent remains on the pad of the orifice. One problem, thus improving production efficiency

Method used

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Embodiment Construction

[0012] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0013] The embodiment of the present invention provides a method for preventing the ink on the pad in the hole of the plug-hole plate with the window on one side of the PCB, which is used to manufacture the PCB, and is characterized in that it includes: after the green oil printing of the PCB, the exposure process is first performed , and then carry out a development process, and add an empty exposure process after the development process.

[0014] Further, in the developing process, an aqueous sodium carbonate solution with a conce...

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Abstract

The invention relates to a method for preventing printing ink in jacks of a single-side-windowed jack panel of a PCB from attaching to a welding pad. The method is used for manufacturing the PCB, and comprises the steps that the PCB is subjected to an exposure working procedure after solder mask printing, and then subjected to a development working procedure and an added empty exposure working procedure after the development working procedure. According to the method, the empty exposure working procedure is added, so that surface of the printing ink in the jacks at single-side-windowed positions are subjected to preliminary curing, a printing ink solvent in the jacks can volatilize towards two sides of the jacks evenly rather than volatilize towards jack surfaces at the single-side-windowed positions, since the solvent in the jacks volatilize towards two sides of the jack ports evenly, printing ink residues formed through volatilization towards one surface of the jack ports excessively cannot appear on the jack ports of the welding pad, the problem that the printing ink or printing ink solvent residues appear on the jack ports of the welding pad can be solved, thereby enhancing production efficiency.

Description

technical field [0001] The invention relates to a method for preventing ink on a pad in a hole of a plug-hole plate with a window on one side of a PCB, and belongs to the field of PCB board manufacturing. Background technique [0002] With the development of mounting technology, it is required to open a window on one side of the PCB board for mounting parts, and oil is required in the hole to ensure that the tin beads will not penetrate from the hole to the other side when mounting the parts, and fall to the components to form Tin short circuit is bad. [0003] In the existing production process, for this kind of PCB board, after the green oil printing exposure and development, it enters the oven to dry the board. When drying, the ink solvent in the PCB board hole will all be opened from one side. One side volatilizes, and some ink or ink solvent will remain on the pad of the hole during the volatilization process, which will cause the parts to be unable to be attached norm...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0073H05K2203/052
Inventor 陈良峰
Owner LONGTENG ELECTRONICS TECH CO LTD
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