Printed circuit board and method for manufacturing a printed circuit board

A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of uneven tin consumption, component offset, components cannot be accurately aligned, and reduce solder paste. The effect of layer area
CN103582302AInactive Publication Date: 2014-02-12WISTRON CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
WISTRON CORP
Publication Date
2014-02-12
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A printed circuit board is disclosed. The printed circuit board includes a solder mask area and at least one chip attachment area. The at least one chip attachment area has an isolation solder mask layer such that the chip attachment area forms a plurality of chip sub-attachment areas to reduce an area of a solder paste smeared on the chip attachment area, and the isolation solder mask layer has at least one hole.
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Description

technical field

[0001] The invention relates to an improvement of a welding pad of a printed circuit board. Background technique

[0002] Surface Mount Technology (SMT) is a process method for soldering electronic components to a printed circuit board. The soldering method is to apply solder paste to the solder pad (Pad) on the printed circuit board, and then Then use a mounting machine to place components (such as IC chips, transistors, etc.) on the solder pads coated with solder paste, and finally go through hot air reflow to melt the solder paste and combine the components with the printed circuit board.

[0003] Due to the demands of high speed and thinness of current electronic products, the heat dissipation of components has become a major issue. Taking a chip made of a quad flat no leads (QFN) package as an example, in order to have a good heat dissipation effect, the thermal pad has a large area. Relatively speaking, its The corresponding pad area will be large. ...

Claims

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