Packaging structure having good assembling operation property

Abstract

An object of the present invention is to provide a low-cost and small package structure with good assembly performance. In the packaging structure of the present invention, the first cover (8) covering the first circuit (5) and the second cover (9) covering the second circuit (7), on which the side plates (8b, 9b) facing each other ) is connected by the connecting portion (10), and since the lower end of the connecting portion (10) and the side plates (8b, 9b) are welded on the circuit board (1), the cover ( 8, 9), its installation performance is good, and low-cost products can be obtained.

Description

technical field [0001] The present invention relates to a package structure suitable for a transceiver unit and the like of a mobile phone. Background technique [0002] If an example is given to illustrate the case where the existing packaging structure is applied to the transceiver unit, then image 3 is a plan view showing the existing package structure, Figure 4 It is a sectional view of main parts showing a conventional package structure. [0003] Below, according to image 3 , 4 Describe the composition of the existing packaging structure. The existing packaging structure is composed of a multi-layer substrate. The circuit board 51 provided with wiring patterns (not shown on the figure) has first and second regions 52 and 53 that are mutually distinguished. Electronic components 54 are mounted on the first area 52 to form a first circuit 55 such as a transmission and reception circuit, and electronic components 56 are mounted on the second area 53 to form a second c...

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Problems solved by technology

[0011] However, since the protrusions of the second jig used in this production are formed with the same size from the bottom end to the entire front end, the protrusions are easily bent, and the jig cannot be used for a long time, and its manufacturing cost increases.

[0012] The existing packaging structure is to assemble the first and second covers 58 and 59 separately, so there are problems of cumbersome work and increased cost

[0013] In addition, since the first and second covers 58 and 59 are fixed to the holes 51c and 51d, the distance between them is large, which leads to a problem of size increase.

[0014] In addition, since the side plates 58b, 59b are bent at right angles from the upper plates 58a, 59a, in order to easily check the adhesion state of the solder 60 between the first and second covers 58, 59, it is necessary to increase the distance between them, resulting in an increase in size. The problem

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