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High efficiency crossed slot microstrip antenna

A technology of microstrip antenna, slot, applied in the direction of antenna, resonant antenna, electric short antenna, etc.

Inactive Publication Date: 2006-06-07
HARRIS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These feeders are phased to provide a multipolar emission pattern

Method used

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  • High efficiency crossed slot microstrip antenna
  • High efficiency crossed slot microstrip antenna
  • High efficiency crossed slot microstrip antenna

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Embodiment Construction

[0024] A cross-slot fed microstrip antenna with reduced size but increased efficiency. This cross-slot fed microstrip antenna also provides enhanced bandwidth. The improved microstrip antenna is formed by locally controlling the effective permittivity and / or effective permeability of one or more dielectric layer portions comprising the antenna.

[0025] Low dielectric constant plate materials are generally chosen for RF designs. For example, products such as RT / duroid® 6002 (dielectric constant 2.94; loss tangent .009) and RT / duroid® 5880 (dielectric constant 2.2; loss tangent .0007) polytetrafluoroethylene (PTFE) based composite. Both materials are common board material choices. The above plate materials provide uniformity in thickness and physical properties over the plate area and provide a dielectric layer with a relatively low dielectric constant accompanied by a low loss tangent. The relative permeability of both materials is close to 1.

[0026] Prior art antenna d...

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Abstract

A cross-slot fed microstrip antenna (100). The antenna (100) includes a conductive ground plane with at least one cross slot (125) and includes at least two feed lines (105). The feed lines (105) have respective stub regions (115) that extend beyond the cross-slot (125) and carry signal energy to or from the cross-slot (125). The antenna (100) also includes a first substrate (150) disposed between the ground plane (120) and the feed line (105). The first substrate (150) includes a first region and at least one second region, each region having different substrate properties. The first zone is adjacent to at least one feeder (105).

Description

Background technique [0001] RF circuits, transmission lines and antenna elements are usually fabricated on specially designed substrates. Conventional circuit board substrates are typically formed by processes such as casting or spray coating, which generally result in uniform substrate physical properties, including uniform dielectric constants. [0002] For RF circuit applications, it is often important to maintain careful control of the impedance characteristics. If the impedances of different parts of the circuit do not match, signal reflections and inefficient power transfer can result. The electrical length of transmission lines and radiators in these circuits can also be a critical design factor. [0003] Two key factors affecting circuit performance involve the dielectric constant of the dielectric substrate material (sometimes called the relative permittivity or ε r ) and loss tangent (sometimes called loss factor). The relative permittivity, or dielectric constan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01Q9/04
CPCH01Q1/38H01Q9/0414H01Q9/0435H01Q9/0442H01Q9/0485H01Q13/106
Inventor 威廉姆·D·基伦兰迪·T·皮克赫里伯托·J·戴尔噶多
Owner HARRIS CORP