Printed circuit board using paste bump and manufacturing method thereof

Abstract

A printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a printed circuit board using paste bumps, comprising: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board onat least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

Description

[0001] Cross References to Related Applications [0002] This application claims priority over Korean Patent Application No. 2005-0109850 filed with the Korean Intellectual Property Office on November 16, 2005 and Korean Patent Application No. 2005-0109855 filed with the Korean Intellectual Property Office on November 16, 2005 rights, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a printed circuit board, more particularly, to a printed circuit board using paste bumps and a manufacturing method thereof. Background technique [0004] The traditional multilayer printed circuit board is to form the inner layer circuit on the surface of the core board such as copper clad laminate (CCL) by applying the additive method or the subtractive method, etc., and by combining with the inner layer circuit The method is the same, and the insulating layer and the metal layer are stacked in sequence to form an oute...

AI Technical Summary

Problems solved by technology

However, this invention achieves full-layer IVH only through paste bump boards, so it has a relatively fragile structure

Also, there is a possibility of a short circuit in a high voltage, high frequency environment, and there are paste bumps filled in the via holes of the board, so that the heat dissipation characteristics through the PTH are not improved

Images