Electronic module

a technology of electronic modules and modules, applied in the field of modules, can solve problems such as solder joint cracking, solder joint failure and delamination, and various components, such as solder attachment points, wire bonds and molding compounds, to achieve the effect of reducing the number of components

Inactive Publication Date: 2005-05-19
DELPHI TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011] One embodiment of the present invention is directed to an electronic module that includes a plurality of electrically conductive lead pins, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The first IC die is attached to the base plate and is electrically coupled to one or more

Problems solved by technology

In spite of the standardized manufacturing processes utilized to assemble the electronic module 100, various components, such as a solder attachment point, wire bonds and the molding compound, have exhibited negative characteristics, e.g., solder joint cracking, wire bond failure and delamination, respectively.
It should be appreciated that these failures may seriously compromise the robustness and long-term reliability of the module 100.
At the very least, such failure causes severe performance degradation and may also result in complete field failures of the module 100.
However, when the molding compound 116 delaminates from either the silicon die 106 or the header 102 (or both), it no longer provides an effective buffer.
However, the addition of polyimide to the design generally results in increased cost and, at times, can be difficult to apply in a consistent manner such that coverages of the areas where no delamination is acceptable are adequately covered.

Method used

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Embodiment Construction

[0021] According to the present invention, an electronic module is described herein that exhibits superior thermal characteristics to those currently available. A module designed according to the present invention exhibits reduced maximum shear stress that is experienced by solder joints between a die and a header and exhibits reduced risk of delamination of the epoxy molding compound from the header. According to one embodiment of the present invention, three rectangular blocks of alumina are attached to the header in close proximity to the silicon die (see FIG. 4).

[0022] With reference to FIG. 4, an electronic module 400 includes three rectangular material, e.g., alumina, blocks 402A, 402B and 402C, which surround a silicon die 106. The blocks 402A-402C may be approximately the same thickness as the die 106. However, it should be appreciated that an exact shape, size and placement of material used in the blocks 402A-402C may be optimized, depending upon the application in which t...

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Abstract

An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.

Description

TECHNICAL FIELD [0001] The present invention is generally directed to a module and, more specifically, an electronic module. BACKGROUND OF THE INVENTION [0002] Electronic modules have been widely utilized in the automotive industry and may take various forms, such as an all silicon ignition (ASI) module implemented in a TO247 package, as is shown in FIG. 1. [0003]FIG. 1 depicts an exemplary electronic module 100 constructed according to the prior art. The electronic module 100 includes an electrically conductive tab / header or base plate 102 that may act as a ground plane and be connected to one or more of a plurality of conductive lead pins 104. A silicon die 106 that includes circuitry to implement a transistor, such as an insulated gate bipolar transistor (IGBT), may be configured such that a drain of the transistor is brought out on a face of the die 106 coupled to the base plate 102. In this configuration, a gate and source of the transistor are brought out on a face of the die ...

Claims

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Application Information

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IPC IPC(8): H01L23/16H01L23/495H01L23/498
CPCH01L23/16H01L23/49575H01L23/49844H01L2924/1433H01L2924/0002H01L2924/00
InventorMITHAL, PANKAJKNIGGA, BRADLEY R.MIDDLETON, STEVEN A.
OwnerDELPHI TECH INC