Heat dissipating system

Inactive Publication Date: 2007-03-22
YEN SUN TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012] Therefore, the object of the present invention is to provide a heat dissipating system for cooling an

Problems solved by technology

Therefore, considerable heat is generated by electronic devices, such as a central processing unit (CPU), of the computer, thereby resulting in a high temperature.
The high temperature can cause improper shut down of the computer and damage to the data stored in the computer.
However

Method used

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Examples

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Example

[0018] Referring to FIG. 2, the preferred embodiment of a heat dissipating system 2 according to this invention includes: a heat sink 24 adapted to be connected to an electronic device 100 for absorbing heat from the electronic device 100; a coolant reservoir 21 for storing a coolant 22 therein; a driving mechanism 25 for drawing the coolant 22 from the coolant reservoir 21; a cooling mechanism 26; a coolant circulating conduit 23 connected to the coolant reservoir 21, the cooling mechanism 26, the heat sink 24, and the driving mechanism 25 such that the driving mechanism 25 draws the coolant 22 from the coolant reservoir 21 and drives circulation of the coolant 22 in the coolant circulating conduit 23 through the heat sink 24 and the cooling mechanism 26 so as to transfer heat from the heat sink 24 to the cooling mechanism 26 through the coolant 22; and a pressure stabilizing mechanism 27 including a bypass 272 connected to the coolant reservoir 21 and the coolant circulating condu...

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Abstract

A heat dissipating system includes: a heat sink adapted to be connected to an electronic device; a coolant reservoir adapted for storing a coolant therein; a driving mechanism; a cooling mechanism; a coolant circulating conduit connected to the coolant reservoir, the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit; and a pressure stabilizing mechanism including a bypass connected to the coolant reservoir and the coolant circulating conduit at a position downstream of the driving mechanism, and a valve. The valve is opened when the pressure inside the coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] This application claims priority of Taiwanese application no. 094216236, filed on Sep. 21, 2005. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] This invention relates to a heat dissipating system, more particularly to a heat dissipating system for cooling an electronic device. [0004] 2. Description of the Related Art [0005] As technology advances in the field of computers, performance of the computer has become more and more powerful. Therefore, considerable heat is generated by electronic devices, such as a central processing unit (CPU), of the computer, thereby resulting in a high temperature. The high temperature can cause improper shut down of the computer and damage to the data stored in the computer. Thus, heat dissipation is a major concern for computer manufacturers. [0006]FIG. 1 shows a conventional heat dissipating device 1 that includes a heat sink 11, a coolant 12, a driving mechanism 13, a cooling mechan...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCH01L23/473H01L2924/0002H01L2924/00
Inventor CHEN, CHIEN-JUNGCHEN, TE-TSUNGHSU, CHIH-TSUNG
Owner YEN SUN TECH CORP
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