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Integrated multi-circuit microchannel heat exchanger

a multi-circuit, heat exchanger technology, applied in indirect heat exchangers, lighting and heating apparatus, stationary conduit assemblies, etc., can solve the problem that microchannel heat exchangers cannot be easily tailored to include such multiple circuit configurations

Inactive Publication Date: 2011-03-10
CARRIER CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a heat exchanger with separate manifolds and microchannel tube banks that are arranged in two directions. This design allows for improved heat transfer and more efficient use of space.

Problems solved by technology

More traditional heat exchangers, such as a round tube and plate fin heat exchangers, can be formed to be of a multi-circuit intertwined configuration utilizing the total frontal area of the heat exchanger, however, microchannel heat exchangers have not been easily tailored to include such multiple circuit configurations.

Method used

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  • Integrated multi-circuit microchannel heat exchanger
  • Integrated multi-circuit microchannel heat exchanger
  • Integrated multi-circuit microchannel heat exchanger

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Experimental program
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Effect test

embodiment 75

[0031]FIGS. 6A and 6B show another embodiment 75 wherein an inlet manifold 82 has three adjacent connecting tubes 84, and hence three adjacent heat exchange tubes, and an inlet manifold 80 has only two adjacent connecting tubes 86, and hence only two adjacent heat exchange tubes. As before, the alternating pattern repeats itself along the manifold axis. In this manner, the relative size of the heat exchanger portion connected to each inlet manifold can be controlled. Of course, ratios other than 3:2 can be utilized. This unequal circuit split may become advantages, for instance, when refrigerant circuits and associated compression systems are of a different size and capacity, allowing for different stages of capacity modulation and unloading. It has to be understood that a single connecting refrigerant tube 84 or 86 of a larger diameter, that leads to adjacent heat exchange tubes, can be utilized instead.

[0032]FIG. 6C is a perspective 3D view showing a detail of the manifold structu...

embodiment 90

[0033]FIGS. 7A and 7B show the power and flexibility of the inventive concept wherein an embodiment 90 has an inlet manifold 92 with associated connecting refrigerant tubes 94, an inlet manifold 96 with associated connecting refrigerant tubes 98, an inlet manifold 110 with associated connecting refrigerant tubes 112, and an inlet manifold 114 with associated connecting refrigerant tubes 116. More than four independent refrigerant circuits flowing through the heat exchanger 90 can be utilized.

[0034]FIG. 7C is a perspective 3D view showing the detail of the manifold arrangement of the FIG. 7A. Additional manifolds can be interfit into available space around the heat exchanger structure as shown in FIG. 7C. As illustrated, the inlet manifolds 96 and 114 are located on one side of the core heat transfer area 21, while the manifolds 92 and 110 are positioned on an opposed side of the core heat transfer area 21. As before, refrigerant flowing through the several inlet manifolds passes int...

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Abstract

A microchannel heat exchanger has at least two manifolds, with the at least two manifolds communicating with a respective one of a first and second plurality of heat exchange tube banks. The first and second plurality of heat exchange tube banks are intertwined within a single microchannel heat exchanger core.

Description

RELATED APPLICATIONS[0001]This application claims priority to U.S. Provisional patent application No. 61 / 080780, which was filed Jul. 15, 2008.BACKGROUND OF THE INVENTION[0002]In recent years, much interest and design effort has been focused on the efficient operation of the heat exchangers (and condensers, gas coolers and evaporators in particular) of refrigerant systems. One relatively recent advancement in heat exchanger technology is the development and application of parallel flow, or so-called microchannel or minichannel, heat exchangers (these two terms will be used interchangeably throughout the text), as the condensers, gas coolers and evaporators.[0003]These heat exchangers are provided with a plurality of parallel heat exchange tubes, typically of a non-round shape, among which refrigerant is distributed and flown in a parallel manner. The heat exchange tubes are orientated generally substantially perpendicular to a refrigerant flow direction in inlet, intermediate and ou...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F9/02
CPCF28D1/0426F28D1/05391F28F2009/0297F28F9/0275F28F2260/02
Inventor TARAS, MICHAEL F.LIFSON, ALEXANDERKIRKWOOD, ALLEN C.
Owner CARRIER CORP