Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings

Abstract

A semiconductor device has a semiconductor die with a plurality of bumps formed over a surface of the semiconductor die. A plurality of conductive traces is formed over a surface of the substrate with interconnect sites. A masking layer is formed over the surface of the substrate. The masking layer has a plurality of parallel elongated openings each exposing at least two of the conductive traces and permitting a flow of bump material along a length of the plurality of conductive traces within the plurality of elongated openings while preventing the flow of bump material past a boundary of the plurality of elongated openings. One of the conductive traces passes beneath at least two of the elongated openings. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surface of the interconnect sites. An encapsulant is deposited around the bumps between the semiconductor die and substrate.

Description

CLAIM TO DOMESTIC PRIORITY[0001]The present application is a continuation-in-part of U.S. patent application Ser. No. 12 / 362,627, filed Jan. 30, 2009, and claims priority to the foregoing parent application pursuant to 35 U.S.C. § 120.FIELD OF THE INVENTION[0002]The present invention relates to semiconductor devices and, particularly, to a semiconductor device and method of forming narrow interconnect sites on a substrate with elongated mask openings.BACKGROUND OF THE INVENTION[0003]Semiconductor devices are commonly found in modern electronic products. Semiconductor devices vary in the number and density of electrical components. Discrete semiconductor devices generally contain one type of electrical component, e.g., light emitting diode (LED), small signal transistor, resistor, capacitor, inductor, and power metal oxide semiconductor field effect transistor (MOSFET). Integrated semiconductor devices typically contain hundreds to millions of electrical components. Examples of integ...

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