Manufacturing method of coreless layer capsulation substrate

A technology for encapsulating substrates and non-nuclear layers, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve the problem of smaller bonding area between solder and surface treatment layer 19 and poor reliability of the overall packaging substrate , Packaging substrates are not easy to separate, etc., to shorten the signal transmission path, avoid poor developing effects, and reduce warping
CN102054710BInactive Publication Date: 2013-01-16UNIMICRON TECH CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
UNIMICRON TECH CORP
Publication Date
2013-01-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a coreless layer capsulation substrate and a manufacturing method thereof. The substrate comprises a layer-adding structure which is provided with a first outer side, a second outer side opposite to the first outer side, at least one second dielectric layer which is provided with a first surface facing to the first outer side and a second surface facing to the second outer side, at least one second line layer which is arranged on the second surface of the second dielectric layer, a plurality of conductive blind holes which are arranged in the second dielectric layer, and a first line layer which is embedded and exposed at the first surface of the second dielectric layer on the outermost layer of the first outer layer of the layer-adding structure, wherein the second line layer on the outermost layer of second outer side is provided with a plurality of second electric contact pads; the first line layer is provided with a plurality of first electric contact pads; and the first line layer is electrically connected to the second line layer through the plurality of conductive blind holes on the layer-adding structure. Besides, the manufacturing method provided by the invention is suitable for the technical property of the traditional machine, and can be used for achieving the purposes such as lowering the cost and the like so as to increase the reliability and yield of the capsulation substrate.
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Description

technical field

[0001] The present invention relates to a method for manufacturing a carrier plate and a coreless layer packaging substrate, in particular to a carrier plate suitable for making a coreless layer package substrate and its manufacturing method, and the coreless layer package made from the carrier plate Substrate manufacturing method. Background technique

[0002] With the vigorous development of the electronic industry, electronic products have gradually entered the development trend of multi-function and high performance. In order to meet the packaging requirements of high integration and miniaturization of semiconductor packages for more active and passive components and circuit loading, semiconductor packaging substrates have gradually evolved from double-layer to multi-layer (multi- layer), so that the interlayer connection technology (interlayer connection) can be used in a limited space to expand the available circuit layout area on the semiconductor pac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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