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Radiator

A radiator and heat sink technology, applied in the direction of instruments, electric solid devices, semiconductor devices, etc., can solve the problems of the thickness of the heat sink, hinder the heat exchange of the heat sink, and increase the thickness of the stagnation layer, so as to reduce the thickness and improve the heat dissipation. The effect of switching efficiency and improving heat dissipation performance

Inactive Publication Date: 2008-12-17
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the size of the heat sink will thicken the stagnant layer on the surface of the heat sink, preventing heat exchange between the heat sink and the airflow
In addition, the top of the traditional heat sink is generally flat, which tends to form a thick stagnant layer on the surface of the heat sink.
The thicker the stagnant layer, the worse the heat exchange efficiency between the heat sink and the airflow. Increasing the size of the heat sink to increase the surface area cannot effectively improve the heat dissipation performance of traditional heat sinks

Method used

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Embodiment Construction

[0015] see Figures 1 to 2 , is a perspective view of the first embodiment of the radiator of the present invention. The heat sink includes a bottom plate 10 contacting with electronic components, a heat sink set 20 disposed on the bottom plate 10 and a fan 30 mounted on the top of the heat sink set 20 . The bottom plate 10 is made of materials with good thermal conductivity, such as metal copper, aluminum and the like. The heat sink group 20 is composed of several heat sinks 22 arranged in sequence. Please refer to image 3 , each heat sink 22 includes a plate body 222 and a folded edge 224 vertically bent from one side of the plate body 222 . These folded edges 224 are connected with the bottom plate 10 by welding, thereby the cooling fin group 20 is fixed on the bottom plate 10; At the same time, these folded edges 224 keep a certain distance between adjacent heat sinks 22, between adjacent heat sinks 22 Create airflow channels. A slot 228 is respectively formed at the...

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Abstract

The invention is a radiator, comprising a radiating fin group and a fan arranged on one side of the radiating fin group, where the radiating fin group comprises several radiating fins, the side of each of which adjacent to the fan is equipped with several gaps, so that the airflow from the fan directly collides the gaps on the radiating fins to make the airflow direction and speed change to disorder the airflow so as to reduce thickness of occluded layer on the radiating fin group, and improve heat exchange efficiency between airflow and radiating fin group, able to effectively improve radiating performance of the radiator.

Description

technical field [0001] The invention relates to a heat sink, in particular to a heat sink applied to electronic components. Background technique [0002] Electronic components (such as central processing unit) generate a lot of heat during operation, which increases the temperature of itself and the system, which in turn leads to a decrease in its operating performance. In order to ensure the normal operation of the electronic components, a cooling device is usually installed on the electronic components to dissipate the heat generated by them. [0003] A traditional cooling device generally includes a bottom plate in contact with electronic components, a plurality of cooling fins arranged on the bottom plate, and a fan installed on top of the cooling fins. The heat generated by the operation of electronic components is absorbed by the bottom plate, and then dissipated to the surrounding environment through the heat sink to cool the electronic components. The operation of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/34H01L23/367H01L23/467G06F1/20H05K7/20
Inventor 陈俊吉翁世勋余光周大远刘金标
Owner FU ZHUN PRECISION IND SHENZHEN