Insulating circuit board and insulating circuit board provided with cooling sink section
A technology of circuit substrates and insulating plates, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of hindering and reducing the total thermal resistance, and achieve the effect of reducing the total thermal resistance.
Active Publication Date: 2009-04-22
MITSUBISHI MATERIALS CORP +1
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Problems solved by technology
However, the thermally conductive lubricating oil is the main factor hindering the reduction of the total thermal resistance
Method used
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Experimental program
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Effect test
Embodiment
[0067] (first verification experiment)
[0068] Here, among the above effects, the circuit board 12 is formed of an Al alloy with a purity of 99.98% or more or pure Al, and the metal plate 13 is formed of an Al alloy with a purity of 98.00% or more and 99.90% or less, so that cracks can be prevented in the first, The occurrence and development of the second solder layers 14, 15 were verified by experiments (hereinafter referred to as "first verification experiments").
[0069] The following configurations were employed as the insulating circuit board with the cooling groove provided for this experiment.
[0070] The insulating plate 11 is made of a material mainly composed of AlN, and its length, width, and thickness are 50 mm, 50 mm, and 0.635 mm, respectively. The circuit board 12 is formed of Al alloy, and its length, width, and thickness are 48 mm, 48 mm, and 0.4 mm, respectively. The metal plate 13 is formed of an Al alloy, and its length, width, and thickness are 48 mm...
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Abstract
An insulating circuit board is provided with an insulating board, a circuit board bonded to a first plane of the insulating board, and a metal plate bonded to a second plane of the insulating board. The circuit board is formed of an Al alloy having a purity of 99.98% or pure Al, and the metal plate is formed of an Al alloy having a purity of 98.00% but not more than 99.90%. A thickness (a) of the circuit board is, for instance, 0.2mm or more but not more than 0.8mm, and a thickness (b) of the metal plate is, for instance, 0.6mm or more but not more than 1.5mm, and an inequality of a / b=1 is satisfied. An insulating circuit board provided with a cooling sink section has the insulating circuit board, and a cooling sink section bonded to the metal plate through a second solder layer. The second solder layer is formed of a solder having Sn as a main ingredient, with a Young's modulus of, for instance, 35GPa or more, a 0.2% proof strength of, for instance, 30MPa or more, and a tensile strength of, for instance, 40MPa or more. The cooling sink section is formed of, for instance, pure Al or an Al alloy.
Description
technical field [0001] The present invention relates to an insulating circuit board used in a semiconductor device that controls large current and high voltage, and an insulating circuit board with a cooling sink portion. [0002] This application claims the priority of Japanese Patent Application No. 2005-268093, Japanese Patent Application No. 2005-268094 and Japanese Patent Application No. 2005-268095 filed on September 15, 2005, and its contents are cited with this. Background technique [0003] As such an insulating circuit substrate with a cooling groove portion, there is, for example, a substrate disclosed in the following Patent Document 1. The schematic configuration of the substrate includes: an insulating plate made of ceramics or the like; A circuit board, an insulating circuit substrate of a metal plate bonded to the other surface of the insulating plate, and a cooling portion provided on the lower surface of the metal plate opposite to the surface bonded to th...
Claims
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IPC IPC(8): H01L23/40H01L23/473H01L25/07H01L25/18
CPCH01L2224/32225
Inventor 黑光祥郎鸟海诚长友义幸石塚博弥马场阳一郎渡边智之安井卓也
Owner MITSUBISHI MATERIALS CORP