Method for raising fine quality rate of semiconductor chip

Abstract

A method for raising yield of semiconductor chip includes coating a negative light-blocking layer on surface of chip, aligning identification code region of chip to light cover, using exposure energy less than that of chip non-identification code region to carry out the first exposure on chip identification code region, making a shift from position of the first exposure and carrying out the second exposure on chip identification code region under the same condition, holding exposed part on adjacent connection edge of chip identification and non-identification code regions, developing unexposed part and preparing complete weld convex point.

Description

technical field [0001] The invention relates to the manufacture of semiconductor chips, in particular to a method for improving the yield rate of semiconductor chips. Background technique [0002] With the miniaturization of the semiconductor manufacturing process, the degree of integration of semiconductor components is getting higher and higher, and there are more and more circuit I / O lines, so more dense conductive connection points - solder bumps are required. The higher the density of solder bumps, the more difficult the processing technology, and the quality of solder bumps directly affects the yield of chips. [0003] To make solder bumps on the wafer, in order to clearly identify the wafer identification code during the solder bump formation process, the double exposure method is used in the wafer identification code area to avoid the formation of solder bumps. For details, refer to Figures 1A-1E . [0004] see Figure 1A , in this process, a layer of negative pho...

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Problems solved by technology

[0008] Due to the use of double exposure in the wafer identification code area, the exposure energy is enhanced, which exposes the edges of several chips in the non-wafer identification code area connected to the wafer identification code area, forming negative photoresist residues, which makes the original soldering The area of ​​the bump disappears, resulting in a decrease in yield

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