Buffering body capable of completely flattening and combination thereof

A technology of a buffer body and a main body is applied in the field of buffer bodies, which can solve the problems of not being able to optimally utilize container space and wasting space, and achieve the effects of saving transportation costs and facilitating assembly.

Inactive Publication Date: 2008-05-28
AOPEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the fixed shape of the buffer bodies 92, 93, when they are stacked in the container, due to the influence of the surrounding walls 921, 931, a large gap is formed between the stacked buffer bodies 92, 93, which wastes a lot of space and cannot reach the container. optimal use of space

Method used

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  • Buffering body capable of completely flattening and combination thereof
  • Buffering body capable of completely flattening and combination thereof
  • Buffering body capable of completely flattening and combination thereof

Examples

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Embodiment Construction

[0063] The aforementioned and other technical contents, features and functions of the present invention will be clearly presented in the following detailed description of two preferred embodiments with reference to the drawings.

[0064] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

[0065] refer to figure 2 , the first preferred embodiment of the fully flattenable cushioning body of the present invention is suitable for packaging a computer case. The buffer body 1 includes a cardboard 2 and a plurality of soft boards 3 made of Styrofoam on the cardboard 2 .

[0066] In the unfolded state, the cardboard 2 includes a main body portion 21 , two first extension portions 22 , two second extension portions 23 and four wing portions 24 . The main body 21 is substantially rectangular and has a set of parallel first sides 211 , a set of parallel second sides 212...

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PUM

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Abstract

The invention discloses a damping body which can be fully leveled, comprising a paper plate and a plurality of soft plates arranged on the paper plate. The paper plate comprises a body part, two first extension parts arranged at the two reverse sides of the body part, two second extension parts at the other two reverse sides of the body part and four wing parts connected two by two with the two reverse sides of all the second extension parts. All soft plates are respectively arranged on the body part, the first extension parts and the second extension parts; furthermore, one side wall in packaging state of the damping body is respectively formed by the first extension parts and the second parts by virtue of folding; all the second extension parts are respectively fixed with the first extension parts by virtue of the wing parts at the two sides; furthermore, the damping body forms a first packaging state in shallow-disc shape from the extension state.

Description

technical field [0001] The invention relates to a buffer body for packaging, in particular to a buffer body for packaging electronic devices. Background technique [0002] At present, the production mode of electronic products is mostly based on division of labor. After various components are manufactured by different foundries, they are then made into finished products by subsequent assembly plants for sale. For example, the manufacturing method of computer hosts usually consists of components (including case, motherboard, power module, electronic card, disk drive, etc.) are manufactured in different factories, and then assembled into a finished computer mainframe. Since the place of origin of the components and the location of the assembly plant may be in different cities or even different countries, the transportation cost of the components from the place of origin to the place of assembly also becomes part of the production cost. [0003] In order to save transportation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/05B65D85/30B65D5/50B65D85/68
Inventor 郑胜雄林德安王武楠黄家佳
Owner AOPEN
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