Front-opening unified pod with wafer constraint modules arranged on both sides of recessed area on door

Abstract

The invention relates to a front-opening unified pod with wafer constraint modules arranged on both sides of a recessed area on a door, which comprises a pod body, wherein a lateral surface of the pod body is provided with an opening, the inside of the pod body is provided with a plurality of slots for accommodating a plurality of wafers, and a door body is combined with the opening of the pod body to protect the wafers in the pod body. The front-opening unified pod is characterized in that: the inner surface of the door body is provided with the recessed area, and the edges of the recessed area are respectively provided with a wafer constraint module; and each wafer constraint module is provided with a base and is fixed on a bulging platform by the base, one long edge of each base is provided with a plurality of spaced bending parts, an approximately-semicircular bulging part is formed between each bending part and a free end thereof, and a central guide groove of each semicircular bulging part is contacted with the wafers to constrain the corresponding wafers to move towards the opening.

Description

technical field [0001] The present invention relates to a front-loading wafer box, in particular to a front-loading wafer box with wafer constraints placed on both sides of the recessed area on the inner surface of the door, in addition to enabling wafers to fall In addition to shortening the size of the front-loading wafer cassette, the recessed area in the entry body can also hold the wafer firmly by the wafer restraint to prevent the wafer from moving during transportation. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of wafers and avoid contamination from the outside, a sealed container is often used for transportation by automated equipment. Please refer to figure 1 Shown is a schematic diagram of a known wafer box. This wafer pod is a front opening type wafer pod (Front Opening Unified Pod, F...

AI Technical Summary

Problems solved by technology

[0004] According to the wafer box of the prior art, the wafer limiting parts are likely to cause problems such as the inability to reduce the size of the wafer box, difficulty in cleaning and loosening of particulate dust, and the like. A main purpose of the present invention is to provide a front opening with a wafer limiting module. Wafer box, the wafer restraint module is placed on both sides of the recessed area on the inner surface of the door, so that the recessed area can effectively accommodate the wafer, and the size of the front and rear diameters of the front-opening wafer box can be shortened

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