Sputter magnetron device
A magnetron, sputtering technology, used in sputtering, discharge tubes, ion implantation, etc.
Active Publication Date: 2012-01-04
深圳豪威显示科技有限公司
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Problems solved by technology
Since the exact requirements for the magnetic field distribution are not clear before we use the columnar magnetron sputtering device for the coating process, even if the required magnetic field distribution can be obtained in advance, after the actual assembly of a cylindrical magnetron sputtering device The distribution of its magnetic field is somewhat different from our expected state
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[0046] like image 3 and Figure 4 As shown, the magnetron device described in the present invention has fewer magnets in the end magnet array 53 than the middle magnet array 52 and the two side magnet arrays 51, and the end magnet array 53 has an irregular layered structure arrangement. In the embodiment of the present invention, since the end magnet arrays are arranged in an irregular layered structure, and the number of end magnets is far less than that of the middle magnets, the present invention cancels the magnetic conductive sheet 7 at the end Structure, and a certain pole surface of magnet is made into the shape surface that cooperates with end magnetizer 534 surface. For example, the end magnets on the planar end magnetizer 534 should also be planar, and the end magnets on the arc-shaped end magnetizer 534 should be a curved surface with the same radian as the curved surface. At the same time, the shape of the magnets at the end is usually not exactly the same, and...
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The invention provides a sputter magnetron device which comprises a positioning base, magnetizers, a fixed shaft and a magnet assembly, wherein the magnet assembly comprises an end magnet array, a middle magnet array and two side magnet arrays axially arranged along an object in parallel; the magnetizers comprise a middle magnetizer and an end magnetizer, and magnetizing sheets which can rotate or slide along the middle magnetizer are arranged between the middle magnet array and two side magnet arrays and the middle magnetizers; and the end magnetizer array is arranged on the end magnetizer and forms a magnetic confining field together with the middle magnet array and the two side magnet arrays. The device regulates the distance and the included angle between the two side magnet arrays and the middle magnet array through the magnetizing sheets, the magnetic field distribution on the surface of the object can be effectively improved, the execution mode of the magnetic field distribution on the surface of the object according to the requirements of sputtering process can be realized, and thus, the process for adjusting the magnetic field distribution becomes simple and efficient.
Description
technical field [0001] The invention relates to the field of vacuum sputtering coating, in particular to a sputtering magnetron device with adjustable magnetic field distribution. Background technique [0002] Magnetron sputtering devices are divided into planar magnetron sputtering devices and cylindrical magnetron sputtering devices according to the type of target. The planar magnetron sputtering devices are relatively Since the target is usually stationary, the relative position of the distribution of the magnetic field on the surface of the target remains unchanged. We know that the distribution of the magnetic field determines the concentration distribution of electrons, which further affects the distribution of plasma concentration. We usually think that the plasma concentration directly affects the etching intensity of the target surface. In this way, we can easily get that the stronger the magnetic induction intensity somewhere on the surface of the target, the stro...
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IPC IPC(8): H01J37/34C23C14/35
Inventor 许生徐升东庄炳河郭杏元
Owner 深圳豪威显示科技有限公司