Cutting device and cutting method for adhesive tape, and applying device and applying method for adhesive tape
A technique for pasting devices and adhesive tapes, applied in lamination devices, chemical instruments and methods, transportation and packaging, etc., capable of solving problems such as poor pasting of adhesive tapes
Inactive Publication Date: 2013-06-12
SHIBAURA MECHATRONICS CORP
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- Abstract
- Description
- Claims
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Problems solved by technology
[0011] In this state, the adhesive tape a that is cut to a specified length is Figure 12B After sticking to the substrate e under pressure as shown, if the release tape c is peeled in the direction of arrow R from the adhesive tape a stuck on the substrate e, for example, by a roller for peeling, etc., the release tape c will not be broken from the adhesive tape a. Attaching the remaining part d remaining in the half-cut part of the release tape c will cause the adhesive tape a and the release tape c to be rolled up together, and in this case, it will cause poor adhesion of the adhesive tape a
Method used
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[0043] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0044] Figure 1 to Figure 6A sticking device of the adhesive tape 2 made of an anisotropic conductive member according to the first embodiment of the present invention is shown, and the sticking device is provided with a substrate placing table 5 . The substrate placing table 5 has a base 6, and a workbench 7 is provided on the upper surface of the base 6. The workbench 7 is driven by the X drive source 6a, the Y drive source 6b, and the θ drive source 6c in X, Driven in the Y and θ directions.
[0045] On the workbench 7, as Figure 2A As shown, a substrate W, such as a liquid crystal display panel, on which two glass plates are bonded is supplied and sucked and held on the stage 7 . On one side portion of the upper surface of the substrate W, a terminal portion 1 having a plurality of terminals 1a formed at predetermined intervals is provided along a predetermined...
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This aims to provide a cutting device and an applying device for an adhesive tape. These devices comprise a cutter (27) driven in directions to come close to and away from an adhesive tape (2), for cutting the adhesive tape when driven in the direction to come closer, a holding block (38) for blocking the warpage of the adhesive tape together with a release tape (8) by a pushing force received from the cutter, when the adhesive tape is to be cut by the cutter, an applied portion (28) integrated with the cutter for pushing the vicinity of that portion of the adhesive tape which is cut by the cutter when the adhesive tape is cut by the cutter, so that the adhesive tape is applied thereto, and a push member (33) for pushing elastically the vicinity of that portion of the adhesive tape which is pushed and applied to the applied portion, thereby to push the adhesive tape elastically and in an unapplied state, when the adhesive tape is cut by the cutter so that the cutter is driven in the direction away from the adhesive tape, till that portion of the adhesive tape which is applied to the applied portion is peeled from the release tape.
Description
technical field [0001] The present invention relates to an adhesive tape cutting device and cutting method for cutting an adhesive tape stuck on a release tape with a cutter, and an adhesive tape sticking device and sticking method for sticking the cut adhesive tape on a substrate. Background technique [0002] For example, in the manufacturing process of flat panel displays represented by liquid crystal display panels and plasma display panels, TCP (Tape) is pasted on the side upper surface of a glass substrate through an adhesive tape composed of an anisotropic conductive member. Carrier Package: The process of electronic components such as tape carrier package). [0003] Before attaching the electronic component to the side upper surface of the substrate, there is a step of affixing the adhesive tape cut into a predetermined length to the side upper surface of the substrate. Adhesive tapes are attached to the release tape and they are rolled on supply reels. [0004] Wh...
Claims
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IPC IPC(8): B65H35/07B26D1/06
CPCB65H35/0013B32B2457/20B32B38/0004B65H35/04B32B37/0046B32B37/1284B26D3/085
Inventor 南浜悦郎森治雄广濑圭刚池田和仁
Owner SHIBAURA MECHATRONICS CORP