Hard aluminum forming mechanism of flat plate type blister packaging machine

Abstract

The invention discloses a hard aluminum forming mechanism of a flat plate type blister packaging machine, which comprises an upper die holder and a lower die holder, wherein the upper die holder is fixed on a bracket of the packaging machine through an upright post, the lower die holder is pushed by a cam mechanism of the packaging machine and can move up and down, a forming punch component is mounted on the upper die holder, a forming matrix is mounted on the lower die holder, and the hard aluminum forming mechanism is characterized in that the forming punch component comprises a forming punch, a punch fixing plate and a pressure plate, the forming punch is fixedly connected with the upper die holder through the punch fixing plate, the punch fixing plate is in sliding connection with the pressure plate through a guide sleeve and a guide pillar, and a return spring is arranged between the punch fixing plate and the pressure plate; and convex points are arranged on the lower surface of the pressure plate, concave points are arranged on the upper surface of the forming matrix, and the convex points and the concave points are arranged correspondingly and matched mutually. The hard aluminum forming mechanism has the advantages of simple structure, convenient die change and good blister forming quality of hard aluminum.

Description

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AI Technical Summary

Benefits of technology

This new design simplifies the process for making high-quality alumina ceramic products such as tungsten carbide (TCI) rods or other materials used in industrial applications like cutting tools made from these materials. It also improves productivity due to fewer parts needed per unit volume compared to previous designs. Overall, this technology provides technical benefits over existing methods while maintaining their efficiency.

Problems solved by technology

This patented technical problem addressed in the patents relates to replacing damaged plasma sheet packages made from aluminium-magnaceous thermoplasmaulbate resin(PMEL), which are commonly found today due to their high cost compared to other materials such as polyethylene terephtaltepside). Current methods involve creating new holes in PET films instead of relying solely upon existing hole technology like stitch bonded sealing. However, these techniques require complex structures and often result in loose flaws during manufacturing processes.

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