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Process for producing substrates free of patterns using an alpha stepper to ensure results

A substrate and process technology, which is used in the field of alpha stepper lithography to produce patternless substrates, can solve the problem of not being very precise in grinding

Active Publication Date: 2015-05-13
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, grinding is not very precise when trying to achieve the desired substrate thickness

Method used

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  • Process for producing substrates free of patterns using an alpha stepper to ensure results
  • Process for producing substrates free of patterns using an alpha stepper to ensure results
  • Process for producing substrates free of patterns using an alpha stepper to ensure results

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Embodiment Construction

[0016] It is to be understood that the invention below provides many different embodiments or examples for implementing different components of the invention. Specific examples of components and configurations are described below to simplify the description. Of course, these are only examples and are not meant to be limiting. In addition, the present invention may repeat reference numerals and / or symbols in different instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the different embodiments and / or configurations discussed. In addition, in the following description, the first component is formed on or above the second component may include the embodiment that the first component and the second component are in direct contact, and may also include the embodiment that other components are formed between the first component and the second component. Examples such that the first part and the second part may not be in ...

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Abstract

The present disclosure provides a method for making an integrated circuit. The method comprises processing a first surface of a substrate to create the integrated circuit and grinding a second surface of the substrate to remove material until the substrate is substantially close to a desire thickness. The method also includes performing a wet etch process over the second surface of the substrate and performing a chemical mechanical polishing (CMP) process over the second surface of the substrate to remove a pattern on the substrate. The second surface of the substrate is examined with a metrological instrument to determine if the second surface is substantially smooth; if the second surface is not substantially smooth, the steps of performing the CMP process and examining the second surface with the metrological instrument are repeated until the second surface is substantially smooth.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, and more specifically, relates to a process for producing a non-patterned substrate by using an alpha stepper photolithography machine. Background technique [0002] In semiconductor technology, the surface of a substrate can be ground to a sufficient thickness so that the radiation passes through to the sensor on the opposite surface of the substrate. The method is used in the fabrication of back-illuminated imaging devices such as complementary metal-oxide-semiconductor (CMOS) image sensors. This grinding can leave a spurious pattern on the surface of the substrate that can distort it when illuminated through the substrate surface and result in incomplete images ultimately produced by the image sensor. [0003] Accordingly, there is currently a desire for a system and method for fabricating devices such as back-illuminated CMOS image sensors in which parasitic patterns...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/77H01L21/306H01L27/146
CPCH01L27/14621H01L27/14627H01L27/1464H01L27/14689
Inventor 翁伟智蔡妙欣黄薰莹
Owner TAIWAN SEMICON MFG CO LTD