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Packaging pedestal for semiconductor

A technology for packaging bases and semiconductors, which is applied in the fields of semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices.

Active Publication Date: 2012-08-29
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a semiconductor package base to solve the problems of the semiconductor package base used for low-light microscopes in the prior art, which are difficult to connect wires and have large use limitations.

Method used

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  • Packaging pedestal for semiconductor
  • Packaging pedestal for semiconductor
  • Packaging pedestal for semiconductor

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Experimental program
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Embodiment Construction

[0025] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] A kind of semiconductor packaging base described in the present invention can be realized in various alternative ways, and the following is an illustration through a preferred embodiment. Of course, the present invention is not limited to this specific embodiment. Those of ordinary skill in the art Known general replacements are undoubtedly covered within the protection scope of the present invention.

[0027] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of illustration, the schematic diagrams are not partially enlarged according to the general scale, which should not be used as a limitation of the present i...

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Abstract

The present invention provides a packaging pedestal for a semiconductor, comprising: a base whose material is glass; a load area arranged on the front side of the base, used for fixing a semiconductor chip; at least one finger arranged on the front side of the base; lead wires arranged on the front side of the base, wherein each finger arranged on the front side of the base is connected with one end of the lead wire, and the other end of the lead wire is provided with pins which are arranged around the load area; and at least one finger arranged on the back side of the base, wherein the positions of the fingers arranged on the back side of the base are one-to-one corresponding to the positions of the fingers arranged on the front side of the base, in addition, the correspondingly arrangedtwo fingers which are respectively arranged on the front side of the base and back side of the base are connected by a through hole which is arranged on the fingers and penetrates the base. The packaging pedestal of the present invention can realize a lead wire connection between the chip and the packaging pedestal more easily, and can effectively improve the quality of a failure analysis on the chip through an emission microscope.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit packaging, in particular to a semiconductor packaging base. Background technique [0002] Emission Microscope (EMMI, Emission Microscope) is a very effective failure observation and analysis method. By observing the photoelectric radiation of the chip, locating the location of the chip failure, and then checking and analyzing the cause of the chip failure, the failure point of the chip can be quickly and accurately found and cause of failure. However, some deep-level failures of the chip are difficult to observe and find through the front of the chip, so it is necessary to observe and find from the back of the chip. Since the traditional package is wire-connected, the front side of the chip is first glued to the chip-carrying area of ​​the package base, and then the pads (Pad) of the chip and the pins (Lead) of the base are connected with aluminum wires or gold wires. ),...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H01L23/15
CPCH01L2224/48091H01L2224/73265H01L2224/45124
Inventor 李刚郑鹏飞
Owner SEMICON MFG INT (SHANGHAI) CORP