Environment-friendly epoxy molding compound and preparation method thereof

An epoxy plastic encapsulant, an environmentally friendly technology, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems affecting the electrical properties, heat resistance and reliability of products, and achieve low production costs, convenient use, and high compatibility. Good capacitive effect
CN102093669BActive Publication Date: 2012-08-22天津凯华绝缘材料股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
天津凯华绝缘材料股份有限公司
Publication Date
2012-08-22

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Abstract

The invention relates to an environment-friendly epoxy molding compound and a preparation thereof, and belongs to the technical field of epoxy molding compounds. The environment-friendly epoxy molding compound is characterized in that: the epoxy molding compound contains a dicyclopentadiene phosphorus-containing epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a polyphosphazene compound; and the mass content of the dicyclopentadiene phosphorus-containing epoxy resin is between 1 and 20 percent. The preparation method is simple in process, convenient in processing, easy in control, low in production cost and high in production efficiency; the epoxy molding compound has good mouldability, reflux resistance and moisture resistance; and a product, namely the epoxy molding compound has the advantages of environmental protection, convenience in use, safety and reliability, good compatibility, good flame retardance and the like.
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Description

technical field

[0001] The invention belongs to the technical field of epoxy molding compound, in particular to an environment-friendly epoxy molding compound and a preparation method thereof. Background technique

[0002] At present, epoxy molding compound is mainly composed of epoxy resin, cross-linking curing agent, curing accelerator and additives. Because of its many outstanding characteristics, such as good thermal stability, insulation, adhesion, good mechanical properties, excellent molding process performance and low cost, it is widely used in the field of electronic component packaging, and then It has become one of the most important electronic chemical materials at present. Like many other organic polymer materials, epoxy resin is also easy to burn, so flame retardants are usually added during use. Most of the flame retardants currently used are halogen derivatives or antimony-containing flame retardants. The existence of halogenated flame retardants will caus...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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