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Radiating module

A heat dissipation module and heat pipe technology, applied in cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of unfavorable product market competition, troublesome operation, high cost, etc., and achieve the effect of saving assembly time and cost

Inactive Publication Date: 2011-06-22
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the industry usually welds or rivets the fasteners on the substrate. However, this method is not only troublesome to operate, but also high in cost, which is not conducive to market competition of products.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] see figure 1 and figure 2 , the cooling module is used for cooling the electronic components on the circuit board (not shown). The heat dissipation module includes a first heat absorbing plate 20, a fin set 30, a first heat pipe 40 thermally connecting the first heat absorbing plate 20 and the fin set 30, a straddle on the first heat pipe 40 and The buckle 50 connected to the first heat absorbing plate 20 , and a second heat pipe 60 thermally connected with the fin set 30 and pressed on the buckle 50 . A fixing piece 22 and a positioning piece 24 are respectively formed on both sides of the first heat pipe 40 on the first heat absorbing plate 20, and a fixing hole 52 and a positioning hole are respectively formed on the buckle piece 50 corresponding to the fixing piece 22 and the positioning piece 24. 54 , the fixing piece 22 is fixed in the fixing hole 52 , and the positioning piece 24 passes through the positioning hole 54 . The heat dissipation module further inc...

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PUM

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Abstract

The invention relates to a radiating module which comprises a heat-absorbing plate, a fin group, a heat pipe used for hotly connecting the heat-absorbing plate to the fin group, and a buckle slab stridden on the heat pipe and fixed on the heat-absorbing plate, wherein a fixing plate and a positioning plate are respectively formed at two sides of the heat pipe on the heat-absorbing plate; a fixing hole and a positioning hole which are respectively corresponding to the fixing plate and the positioning plate are formed on the buckle slab; the fixing plate is fixed in the fixing hole; and the positioning plate passes through the positioning hole. Compared with the prior art, the radiating module provided by the invention has the advantages that the fixing plate and the positioning plate are arranged on the heat-absorbing plate, the buckle slab and the heat-absorbing plate can be positioned with no need of tools, and the assembling time and cost are saved.

Description

technical field [0001] The invention relates to a cooling module, in particular to a cooling module for cooling electronic components. Background technique [0002] With the acceleration of computing speed of electronic components (such as the central processing unit in a notebook computer, etc.), the heat generated by them is also increasing. Therefore, the industry generally adopts a heat dissipation module to dissipate heat from these electronic components. The heat dissipation module usually includes a plurality of substrates in thermal contact with the electronic components, heat dissipation fins, a plurality of heat pipes thermally connected to the substrates and the heat dissipation fins, and fasteners placed on the heat pipes. Both ends of the buckle are used to fasten on the circuit board, so as to fix the cooling module. When assembling the heat dissipation module, it is necessary to fix the buckle at a specific position to prevent it from being displaced, so as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/40
CPCH01L23/427H01L23/467H01L2924/0002H01L2924/00
Inventor 杨红成曹磊郭建
Owner FU ZHUN PRECISION IND SHENZHEN