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Thermosetting adhesive film, adhesive film with dicing film, and manufacturing method of semiconductor apparatus using the thermosetting adhesive film or the adhesive film with dicing film

A technology for gluing films and cutting films, which is used in film/sheet adhesives, semiconductor devices, semiconductor/solid-state device manufacturing, etc. Reliability decline and other problems, to achieve the effect of improving manufacturing efficiency

Active Publication Date: 2011-08-17
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if no filler is added, the tensile storage elastic modulus of the die-bonding film may decrease, resulting in a new problem of lowering the reliability of the package.
In addition, if no filler is added, the thermal shrinkage of the die-bonding film during thermal curing may cause warping and damage of the semiconductor chip
[0008] In addition to not being limited to die-bonding films, when thermosetting adhesive films are configured without adding fillers, the tensile storage elastic modulus may decrease, or thermal shrinkage may occur during thermosetting.

Method used

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  • Thermosetting adhesive film, adhesive film with dicing film, and manufacturing method of semiconductor apparatus using the thermosetting adhesive film or the adhesive film with dicing film
  • Thermosetting adhesive film, adhesive film with dicing film, and manufacturing method of semiconductor apparatus using the thermosetting adhesive film or the adhesive film with dicing film
  • Thermosetting adhesive film, adhesive film with dicing film, and manufacturing method of semiconductor apparatus using the thermosetting adhesive film or the adhesive film with dicing film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0134] The following (a) to (c) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0135] (a) 283 parts by weight of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EPPN501HY)

[0136] (b) Phenolic resin (Meiwa Kasei Co., Ltd. product, MEH7851) 283 parts by weight

[0137] (c) Acrylic resin (manufactured by Nagase ChemTex Co., Ltd., Teisan Resin SG-70L, glass transition temperature: -13° C.) 100 parts by weight

[0138] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 38 μm and subjected to silicone release treatment, and dried at 130° C. 2 minutes. Thus, an adhesive film with a thickness of 3 μm was produced.

Embodiment 2-1

[0140] The following (a) to (c) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0141] (a) Epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EPPN501HY) 200 parts by weight

[0142] (b) Phenolic resin (Meiwa Kasei Co., Ltd. product, MEH7851) 200 parts by weight

[0143] (c) Acrylic resin (manufactured by Nagase ChemTex Co., Ltd., Teisan Resin SG-P3, glass transition temperature: 12° C.) 100 parts by weight

[0144] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 38 μm and subjected to silicone release treatment, followed by drying at 130° C. 2 minutes. Thus, an adhesive film with a thickness of 3 μm was produced.

Embodiment 3-1

[0146] The following (a) to (c) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0147] (a) Epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EPPN501HY) 50 parts by weight

[0148] (b) 50 parts by weight of phenol resin (Meiwa Kasei Co., Ltd. product, MEH7851)

[0149] (c) Acrylic resin (manufactured by Negami Industry Co., Ltd., Parachrom W-248, glass transition temperature: 7° C.) 100 parts by weight

[0150] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 38 μm and subjected to silicone release treatment, and dried at 130° C. 2 minutes. Thus, an adhesive film with a thickness of 3 μm was produced.

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Abstract

The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260 DEG C. after thermosetting of 2x105 to 5x107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 [mu]m.

Description

technical field [0001] The present invention relates to a thermosetting adhesive film used for adhesively fixing a small workpiece such as a semiconductor chip to an adherend such as a substrate or a lead frame. In addition, the present invention relates to an adhesive film with a dicing film in which the thermosetting adhesive film and a dicing film are laminated. In addition, the present invention relates to a method of manufacturing a semiconductor device using the thermosetting adhesive film or the adhesive film with a dicing film. Background technique [0002] Conventionally, in the manufacturing process of a semiconductor device, a silver paste is used when a semiconductor chip is fixed to a lead frame or an electrode member. The fixing process is performed by applying a paste-like adhesive on pads of the lead frame, etc., mounting a semiconductor chip thereon, and curing the paste-like adhesive layer. [0003] However, the paste-like adhesive has large variations in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J133/00C09J163/00C09J7/02H01L23/48H01L23/488C09J7/10
CPCC09J133/08H01L2224/83855H01L24/29H01L2224/73265C09J2203/326H01L24/45H01L2924/01015H01L2224/48091C08L71/00C09J2461/00H01L2224/92165H01L24/48H01L2224/85205C09J2433/00H01L2224/2919H01L2924/01013H01L2224/45144H01L2224/92247H01L2224/83191C09J7/00H01L2224/48247H01L2924/01012H01L24/83H01L24/85H01L23/3121H01L2224/32225H01L21/561H01L2924/15747C08L63/00H01L24/92C09J2463/00H01L2224/83097H01L2924/00013H01L2924/01047C09J2201/61H01L2224/45124C08L33/08H01L2924/3025H01L2224/45147H01L2224/94H01L2224/32245H01L2924/01014H01L2224/73215H01L2224/29023C09J161/06C08L2205/03C08G59/621H01L2224/9205H01L2224/85097H01L2924/01029C09J163/00H01L24/32H01L2224/48227H01L2924/15788H01L2924/181H01L24/73C09J7/10C08L33/00C08L61/04C08L63/08C08L2666/02H01L2924/00014Y10T156/10Y10T428/24355Y10T428/265C09J2301/304H01L2224/27H01L2924/00H01L2224/13099H01L2224/13599H01L2224/05599H01L2224/05099H01L2224/29099H01L2224/29599H01L2924/3512H01L2924/00012H01L2224/85399C09J7/35C09J9/00H01L21/6836H01L2221/68327C09J2301/312
Inventor 菅生悠树井上刚一大西谦司
Owner NITTO DENKO CORP
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