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Mounting apparatus

A technology for installing machines and taking out devices, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of increasing the total time, and achieve the effect of suppressing the increase of the total time

Active Publication Date: 2014-12-10
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the mounting machine of the above-mentioned patent document 1, since the taking-out operation of the flip chip from the holding table and the delivery operation of the flip chip to the mounting head are performed for each flip chip, there is a problem that multiple flip chips The total time required for the delivery operation of mounting chips (wafer components) increases
[0006] In addition, in the above-mentioned Patent Document 2, since the taking-out operation of the wafer component from the component supply table and the delivery operation of the wafer component to the mounting suction nozzle are performed for each wafer component, there is a problem that a plurality of wafer components Total time required to deliver actions increased

Method used

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no. 1 approach

[0026] Refer below Figure 1 to Figure 7 , the configuration of the mounting machine 100 according to the first embodiment of the present invention will be described. In addition, in order to clarify the directional relationship, XYZ rectangular coordinate axes are suitably shown in the figure. The X-axis direction is a direction parallel to the horizontal plane, the Y-axis direction is a direction perpendicular to the X-axis direction on the horizontal plane, and the Z-axis direction is a direction perpendicular to the X-axis and the Y-axis respectively.

[0027] The mounting machine 100 is a so-called composite type mounting machine that can take out a bare chip from a diced wafer W and mount (mount) it on a printed circuit board P, and mount package components and the like supplied from the component supply device 160 to the printed circuit board P. on board P. The printed circuit board P is an example of the "substrate" of the present invention.

[0028] Such as figure...

no. 2 approach

[0086] Then refer to Figure 10 and Figure 11 , the mounting machine 300 according to the second embodiment of the present invention will be described. In this second embodiment, an example different from the above-mentioned first embodiment, that is, an example in which two take-out devices are provided will be described.

[0087] In the second embodiment, as Figure 10 As shown, two extraction devices (first extraction device 301 and second extraction device 302) are provided. The configurations of the first take-out device 301 and the second take-out device 302 are the same as those of the take-out device 6 of the above-mentioned first embodiment. The first extractor 301 and the second extractor 302 are fixed together on the front side of the frame member 62 and are movably supported by an unillustrated fixed rail extending in the X-axis direction, and each moves along the fixed rail. The drive units of the first take-out device 301 and the second take-out device 302 h...

no. 3 approach

[0096] Then refer to Figure 12 , Figure 13 and Figure 14 , the mounting machine 400 according to the third embodiment of the present invention will be described. In this third embodiment, an example different from the above-mentioned first embodiment in which one extraction device 6 having two wafer heads is provided, that is, an example in which two extraction devices having one wafer head are provided will be described.

[0097] In the third embodiment, if Figure 12 and Figure 13 As shown, two extraction means (first extraction means 401 and second extraction means 402) are provided. The first take-out device 401 and the second take-out device 402 are movably supported together on a fixed rail extending in the X-axis direction on the front side of the frame member 62 . The first take-out device 401 and the second take-out device 402 can move independently of each other in the X-axis direction on the fixed rail of the frame member 62 by using the same hollow motor m...

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PUM

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Abstract

The invention provides a mounting apparatus, comprising: a base; a chip keep bench capable of keeping chip elements; an upward pushing device provided with a mechanism pushing up the chip elements kept on the chip keep bench from the lower part; a plurality of withdrawing head parts used for adsorbing the chip elements pushed up by the upward pushing device; a head part unit provided with a plurality of installing head parts receiving the chip elements from the withdrawing head parts and installing the chip elements onto a substrate; wherein, each mounting head part of the plurality of mounting head parts simultaneously receives the chip elements respectively absorbed by the withdrawing parts. Therefore, a mounting apparatus advantaged by shorter summation time required by delivering motion of the plurality of chip elements is provided.

Description

technical field [0001] The present invention relates to a mounting machine, and more particularly to a mounting machine provided with a take-out head for absorbing a wafer component pushed up by a push-up device. Background technique [0002] Hitherto, as a mounting machine equipped with a chip component pushed up by a push-up device and capable of turning up and down, Japanese Patent No. 4016982 (hereinafter referred to as Patent Document 1) and Japanese Patent Laid-Open The mounter described in Japanese Unexamined Patent Application Publication No. 2004-103923 (hereinafter referred to as Patent Document 2). [0003] The above-mentioned Patent Document 1 discloses a mounting machine including: a holding table (wafer holding table) that holds flip chips (wafer components) and is movable in the XY directions; (Push-up device), a take-out head that sucks flip chips, and a mounting head that receives flip chips from the take-out head and mounts them on a substrate. In the mou...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K13/02H01L21/50H01L21/58
Inventor 养老进也小林一裕
Owner YAMAHA MOTOR CO LTD