Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof

A heat dissipation bracket and integrated packaging technology, applied in the field of LED brackets, can solve the problems of affecting the heat dissipation effect, reducing the LED life, and many heat dissipation paths, and achieve the effects of controlling the amount of glue dispensed, reliable performance, and easy packaging operation.

Inactive Publication Date: 2012-05-02
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, there are many styles of LED brackets, which are generally directly soldered to the circuit board, so there are many heat dissipation paths, which affect the heat dissipation effect and reduce the life of the LED.

Method used

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  • Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof
  • Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof
  • Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] see figure 1 as well as figure 2 , the heat dissipation support for LED integrated packaging of the present invention includes an aluminum heat dissipation substrate 8 with a dispensing hole 9 and a crystal-fixing hole 10 on the surface, the crystal-fixing hole 10 is provided at the bottom of the dispensing hole 9, and the dispensing The hole 9 and the solid crystal hole 10 are concentric holes, and the surface of the aluminum heat dissipation substrate 8 is provided with an insulating layer 7. The insulating layer 7 is prepared by aluminum hard anodizing, and the insulating layer 7 on the inner wall of the dispensing hole 9 is stamped There are electrodes 11, and the material of the electrodes 11 is copper foil.

[0026] The preparation method of the above-mentioned heat dissipation support for LED integrated packaging comprises the following steps:

[0027...

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PUM

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Abstract

The invention provides a heat radiating bracket for integrated packing of light emitting diode (LED) and a preparation method thereof. The heat radiating bracket comprises an aluminum heat radiating substrate and a glue spotting hole which is arranged on the aluminum heat radiating substrate, wherein the bottom part of the glue spotting hole is provided with a crystal fixing hole, the surface of the aluminum heat radiating substrate is provided with an insulation layer, and an electrode is punched on the insulation layer on the inner wall of the glue spotting hole. The electrode is directly punched and fixed on the aluminum heat radiating substrate with the surface having the insulation layer, so not only can the heat radiating bracket is easy to prepare, is the performance reliable, and is the cost low, butr also the subsequent packing operation of the LED is simpler and more convenient, and the mass production can be realized.

Description

technical field [0001] The invention relates to an LED bracket, in particular to a heat dissipation bracket for LED integrated packaging and a preparation method thereof. Background technique [0002] As a new solid-state green lighting source, LED lighting has the advantages of high luminous efficiency, long life, energy saving and environmental protection, and its application is becoming more and more extensive. Since LEDs have high brightness and high power, people have higher and higher requirements for LED brackets. LED brackets are required to improve the heat dissipation of LEDs and increase the luminous flux of LEDs when they are used. At the same time, the cost of LED brackets is also required not to be too high. [0003] At present, there are many styles of LED brackets, which are generally directly soldered to the circuit board, so there are many heat dissipation paths, which affect the heat dissipation effect and reduce the life of the LED. Therefore, how to dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/62
Inventor 李韶杰
Owner SHAANXI UNIV OF SCI & TECH
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