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Interfacing a light emitting diode (led) module to a heat sink assembly, a light reflector and electrical circuits

A technology of LED modules and light-emitting diodes, which is applied in the direction of semiconductor devices, circuit layouts, light sources, etc.

Active Publication Date: 2014-11-26
SIGNIFY HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While this conventional design provides adequate cooling between the bottom of the LED module and the flat surface of the heat sink, it fails to cool the sides and top of the LED module

Method used

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  • Interfacing a light emitting diode (led) module to a heat sink assembly, a light reflector and electrical circuits
  • Interfacing a light emitting diode (led) module to a heat sink assembly, a light reflector and electrical circuits
  • Interfacing a light emitting diode (led) module to a heat sink assembly, a light reflector and electrical circuits

Examples

Experimental program
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Embodiment Construction

[0041] Referring now to the drawings, the details of an exemplary embodiment of the present invention are schematically shown. The same reference numerals represent the same components in the figures, and the same reference numerals with different lowercase letter subscripts represent similar components.

[0042] See figure 1 , Showing a schematic exploded perspective view of a modular LED device according to a specific example embodiment of the present invention, the LED device including a heat sink, an assembly ring, an LED light engine module with electrical leads, and a locking ring. The LED device generally identified by reference numeral 10 includes a back heat sink 105, a mounting ring 102, an LED module 120, a wire 106, and a locking ring 104. When the mounting ring 102 and the locking ring 104 are assembled together with the LED module 120 between them, the opening 98 in the mounting ring 102 and the opening 97 in the locking ring 104 allow the wires 106 to be led out. ...

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Abstract

A light emitting diode (LED) module is in thermal communication with front and back heat sinks for dissipation of heat therefrom. The LED module is physically held in place with at least the back heat sink. A mounting ring and locking ring can also be used to hold the LED module in place and in thermal communication with the back heat sink. Key pins and key holes are used to prevent using a high power LED module with a back heat sink having insufficient heat dissipation capabilities required for the high power LED module. The key pins and key holes allow lower heat generating (power) LED modules to be used with higher heat dissipating heat sinks, but higher heat generating (power) LED modules cannot be used with lower heat dissipating heat sinks.

Description

[0001] Related patent applications [0002] This application requires the US Provisional Patent Application Serial No. 61 / 332,731 filed on May 7, 2010 and entitled "Systems, Methods and Devices for a Modular LED Light Engine" and the combined title filed on July 21, 2009 Priority of US Provisional Patent Application Serial No. 61 / 227,333 for "LED Module Interface for a Heat Sink and a Reflector". For all purposes, these two patent documents are incorporated herein by reference. Technical field [0003] The present invention relates to apparatus and methods for manufacturing light emitting diode ("LED") devices. More specifically, the present invention relates to an apparatus and method for connecting a heat sink, a reflector, and an electrical connector to an LED device module. Background technique [0004] LEDs as light sources provide benefits over incandescent and fluorescent lamps. These benefits include higher energy efficiency and longer service life. To produce a given li...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/00F21S2/00F21V17/10F21Y101/02
CPCF21V7/00F21V7/22F21V17/14F21V29/2231F21V7/06F21V19/0055F21V23/06F21Y2101/02F21V29/004F21V29/262F21V29/26F21Y2105/001F21V15/01F21V29/2206F21V17/005F21Y2101/00F21Y2105/10F21Y2115/10F21V7/24F21V29/713F21V29/74F21V29/773F21V29/503F21V29/70F21V29/75
Inventor G·沃斯基
Owner SIGNIFY HLDG BV