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Apparatus and method for increasing bandwidths of stacked dies

A technology of die and package structure, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., and can solve the problems that stacked die cannot be reused, and the data bandwidth limitation of the package structure, etc.

Active Publication Date: 2014-12-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Accordingly, stacked die can no longer be used in other package configurations
This creates a limitation on the total number of TSVs, which in turn causes a limitation on the data bandwidth of the encapsulation structure

Method used

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  • Apparatus and method for increasing bandwidths of stacked dies
  • Apparatus and method for increasing bandwidths of stacked dies
  • Apparatus and method for increasing bandwidths of stacked dies

Examples

Experimental program
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Embodiment Construction

[0034] The making and using of various embodiments of the invention are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are exemplary only, and do not limit the scope of the invention.

[0035] According to one embodiment, a package structure including stacked dies and a method of forming the same are provided. Variations and operations of the embodiments are then discussed. Like reference numerals refer to like elements throughout the illustrated and described embodiments.

[0036] figure 1 Depicted is a cross-sectional view of package structure 20 including interposer 22, die carrier 200 (including 200A, 200B, and 200C), device die 100 (including 100A, 100B, 100C, and 100D), carrier ID lines 24 , address and control lines 26 (hereinafter referred to as address / control lines), and a data bus 28 . Dev...

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PUM

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Abstract

A package structure includes a plurality of die carriers identical to each other. The respective features in each of the plurality of die carriers vertically overlap corresponding features in other ones of the plurality of die carriers. Each of the plurality of die carriers includes a plurality of through-substrate vias (TSVs) including a plurality of data buses. The plurality of die carriers is stacked and electrically connected to each other through the plurality of TSVs. The package structure further includes a plurality of device dies. Each of the plurality of device dies is bonded to one of the plurality of die carriers. Each of the plurality of data buses is configured to dedicate to data transmission of one of the plurality of device dies.

Description

technical field [0001] The invention relates to a packaging structure of stacked dies and a forming method thereof. Background technique [0002] Die stacking for increased data storage capacity and bandwidth. Stacking die also has the advantage of reducing package area. Typically, through substrate vias (TSVs) are used to transfer data between stacked die. [0003] There is often a need to balance data bandwidth with the number of TSVs fabricated in each stacked die. With stricter requirements on data storage capacity and bandwidth, more TSVs need to be formed in the die. However, increasing the number of TSVs requires an increase in the size of the stacked die and a greater need to customize the stacked die for a specific package structure. Accordingly, stacked die cannot be used for other packaging structures. This creates a limitation on the total number of TSVs, which in turn creates a limitation on the data bandwidth of the encapsulation structure. Contents of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L23/52H01L23/48
CPCH01L2225/0652H01L2225/06548H01L25/0652H01L2224/16145H01L2225/06572H01L25/0657H01L23/48
Inventor 汲世安彭迈杉
Owner TAIWAN SEMICON MFG CO LTD